Franz Stueckler

Person

St. Stefan, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices with improved thermal and electrical performance
- Patent number 10,373,897
- Issue date Aug 6, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 9,978,671
- Issue date May 22, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package comprising side wall marking
- Patent number 9,972,576
- Issue date May 15, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with top side cooling heat sink thermal pathway
- Patent number 9,812,373
- Issue date Nov 7, 2017
- Infineon Technologies AG
- Christian Fachmann
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Backside processing of semiconductor devices
- Patent number 8,866,299
- Issue date Oct 21, 2014
- Infineon Technologies AG
- Mark Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside processing of semiconductor devices
- Patent number 8,487,440
- Issue date Jul 16, 2013
- Infineon Technologies AG
- Mark Harrison
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC CIRCUIT
- Publication number 20220254934
- Publication date Aug 11, 2022
- Richard Hensch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Circuit with a Transistor Device and a Level Shifter
- Publication number 20200044096
- Publication date Feb 6, 2020
- Richard Hensch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH IMPROVED THERMAL AND ELECTRICAL PERFORMANCE
- Publication number 20170179009
- Publication date Jun 22, 2017
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package comprising side wall marking
- Publication number 20170148743
- Publication date May 25, 2017
- Infineon Technologies Austria AG
- Ralf OTREMBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Spreader, Electronic Module Comprising a Heat Spreader and Met...
- Publication number 20160163616
- Publication date Jun 9, 2016
- INFINEON TECHNOLOGIES AG
- Christian Fachmann
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20150270208
- Publication date Sep 24, 2015
- Infineon Technologies Austria AG
- Ralf OTREMBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS
- Publication number 20150228607
- Publication date Aug 13, 2015
- INFINEON TECHNOLOGIES AG
- Tobias Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND CHIP PACKAGE
- Publication number 20140210061
- Publication date Jul 31, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Processing of Semiconductor Devices
- Publication number 20140015141
- Publication date Jan 16, 2014
- Infineon Technoloiges AG
- Mark Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS
- Publication number 20120068345
- Publication date Mar 22, 2012
- INFINEON TECHNOLOGIES AG
- Tobias Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Processing of Semiconductor Devices
- Publication number 20120007244
- Publication date Jan 12, 2012
- Mark Harrison
- H01 - BASIC ELECTRIC ELEMENTS

Franz Stueckler

Person

Patents Grantslast 30 patents

Semiconductor devices with improved thermal and electrical performance

Power semiconductor device

Semiconductor chip package comprising side wall marking

Semiconductor package with top side cooling heat sink thermal pathway

Backside processing of semiconductor devices

Backside processing of semiconductor devices

Patents Applicationslast 30 patents

ELECTRONIC CIRCUIT

Electronic Circuit with a Transistor Device and a Level Shifter

SEMICONDUCTOR DEVICES WITH IMPROVED THERMAL AND ELECTRICAL PERFORMANCE

Semiconductor chip package comprising side wall marking

Heat Spreader, Electronic Module Comprising a Heat Spreader and Met...

POWER SEMICONDUCTOR DEVICE

LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS

CHIP ARRANGEMENT AND CHIP PACKAGE

Backside Processing of Semiconductor Devices

LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS

Backside Processing of Semiconductor Devices