Franz-Xaver Muehlbauer

Person

Rimbach, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including an antenna
- Patent number 11,195,787
- Issue date Dec 7, 2021
- Infineon Technologies AG
- Ngoc-Hoa Huynh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a cavity lid
- Patent number 10,626,012
- Issue date Apr 21, 2020
- Infineon Technologies AG
- Franz-Xaver Muehlbauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with a through port for sensor applications
- Patent number 10,549,985
- Issue date Feb 4, 2020
- Infineon Technologies AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded system and a method for adhesively bonding a hygroscopic mat...
- Patent number 10,332,814
- Issue date Jun 25, 2019
- Infineon Technologies AG
- Claus Von Waechter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a method of producing the same
- Patent number 9,981,843
- Issue date May 29, 2018
- Infineon Technologies AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including a MEMS die and a conductive layer
- Patent number 9,725,303
- Issue date Aug 8, 2017
- Infineon Technologies AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING AN ANTENNA
- Publication number 20220148951
- Publication date May 12, 2022
- INFINEON TECHNOLOGIES AG
- Ngoc-Hoa Huynh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUSES WITH RADIO-FREQUENCY LINE ELEMENTS, AND A...
- Publication number 20190198455
- Publication date Jun 27, 2019
- INFINEON TECHNOLOGIES AG
- Walter HARTNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with a Through Port for Sensor Applications a...
- Publication number 20180148322
- Publication date May 31, 2018
- INFINEON TECHNOLOGIES AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING AN ANTENNA
- Publication number 20170236776
- Publication date Aug 17, 2017
- INFINEON TECHNOLOGIES AG
- Ngoc-Hoa Huynh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package and a Method of Producing the Same
- Publication number 20160311679
- Publication date Oct 27, 2016
- INFINEON TECHNOLOGIES AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A CAVITY LID
- Publication number 20160297672
- Publication date Oct 13, 2016
- INFINEON TECHNOLOGIES AG
- Franz-Xaver Muehlbauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED SYSTEM AND A METHOD FOR ADHESIVELY BONDING A HYGROSCOPIC MAT...
- Publication number 20160247739
- Publication date Aug 25, 2016
- INFINEON TECHNOLOGIES AG
- Claus Von Waechter
- H01 - BASIC ELECTRIC ELEMENTS

Franz-Xaver Muehlbauer

Person

Patents Grantslast 30 patents

Semiconductor device including an antenna

Semiconductor device including a cavity lid

Semiconductor package with a through port for sensor applications

Bonded system and a method for adhesively bonding a hygroscopic mat...

Chip package and a method of producing the same

Semiconductor device including a MEMS die and a conductive layer

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING AN ANTENNA

SEMICONDUCTOR APPARATUSES WITH RADIO-FREQUENCY LINE ELEMENTS, AND A...

Semiconductor Package with a Through Port for Sensor Applications a...

SEMICONDUCTOR DEVICE INCLUDING AN ANTENNA

Chip Package and a Method of Producing the Same

SEMICONDUCTOR DEVICE INCLUDING A CAVITY LID

BONDED SYSTEM AND A METHOD FOR ADHESIVELY BONDING A HYGROSCOPIC MAT...