Franziska Brem

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Kushacht, CH

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Patents Grantslast 30 patents

Information Patent Grant
Sensor mounted in flip-chip technology on a substrate
- Patent number 8,791,532
- Issue date Jul 29, 2014
- Sensirion AG
- Markus Graf
- G01 - MEASURING TESTING
Information Patent Grant
Sensor mounted in flip-chip technology at a substrate edge
- Patent number 8,736,002
- Issue date May 27, 2014
- Sensirion AG
- Markus Graf
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing a sensor device with a stress relief layer
- Patent number 7,901,971
- Issue date Mar 8, 2011
- Sensirion AG
- Werner Hunziker
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SENSOR MOUNTED IN FLIP-CHIP TECHNOLOGY ON A SUBSTRATE
- Publication number 20120267731
- Publication date Oct 25, 2012
- Markus Graf
- G01 - MEASURING TESTING
Information Patent Application
SENSOR MOUNTED IN FLIP-CHIP TECHNOLOGY AT A SUBSTRATE EDGE
- Publication number 20120217593
- Publication date Aug 30, 2012
- Markus Graf
- G01 - MEASURING TESTING
Information Patent Application
Temperature sensor with buffer layer
- Publication number 20100117185
- Publication date May 13, 2010
- Sensirion AG
- Werner Hunziker
- G01 - MEASURING TESTING
Information Patent Application
Method for manufacturing a sensor device with a stress relief layer
- Publication number 20100035373
- Publication date Feb 11, 2010
- Werner Hunziker
- G01 - MEASURING TESTING