Fred C. Redecker

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Fremont, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus to decouple power and cavitation for megasonic...
- Patent number 7,165,563
- Issue date Jan 23, 2007
- Lam Research Corporation
- John M. Boyd
- B08 - CLEANING
Information Patent Grant
Wafer bevel edge cleaning system and apparatus
- Patent number 6,910,240
- Issue date Jun 28, 2005
- Lam Research Corporation
- John M. Boyd
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Method and Apparatus for Semiconductor Wafer Cleaning Using High-Fr...
- Publication number 20070119477
- Publication date May 31, 2007
- LAM RESEARCH CORPORATION
- Fred C. Redecker
- B08 - CLEANING
Information Patent Application
BARRIER LAYER BUFFING AFTER CU CMP
- Publication number 20010055880
- Publication date Dec 27, 2001
- SHIJIAN LI
- H01 - BASIC ELECTRIC ELEMENTS