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Frederic Metral
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Saint Hilaire du Touvet, FR
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Patents Grants
last 30 patents
Information
Patent Grant
Process for bonding by molecular adhesion
Patent number
8,158,013
Issue date
Apr 17, 2012
Soitec
Sebastien Kerdiles
C03 - GLASS MINERAL OR SLAG WOOL
Information
Patent Grant
Equipment for bonding by molecular adhesion
Patent number
8,091,601
Issue date
Jan 10, 2012
S.O.I. Tec Silicon on Insulator Technologies
Sebastien Kerdiles
C03 - GLASS MINERAL OR SLAG WOOL
Information
Patent Grant
Methods for preparing a bonding surface of a semiconductor wafer
Patent number
7,919,391
Issue date
Apr 5, 2011
S.O.I. Tec Silicon on Insulator Technologies
Cécile Delattre
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Planarization of a heteroepitaxial layer
Patent number
7,718,534
Issue date
May 18, 2010
S.O.I. Tec Silicon on Insulator Technologies
Muriel Martinez
B24 - GRINDING POLISHING
Information
Patent Grant
Process and equipment for bonding by molecular adhesion
Patent number
7,601,271
Issue date
Oct 13, 2009
S.O.I. Tec Silicon on Insulator Technologies
Sebastien Kerdiles
C03 - GLASS MINERAL OR SLAG WOOL
Information
Patent Grant
Method for recycling a substrate
Patent number
7,022,586
Issue date
Apr 4, 2006
S.O.I.Tec Silicon on Insulator Technologies S.A.
Christophe Maleville
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Surface preparation for receiving processing treatments
Patent number
6,988,936
Issue date
Jan 24, 2006
S.O.I.Tec Silicon on Insulator Technologies S.A.
Laurent Filipozzi
B24 - GRINDING POLISHING
Information
Patent Grant
Method for automatically determining the surface quality of a bondi...
Patent number
6,881,596
Issue date
Apr 19, 2005
S.O.I.Tec Silicon on Insulator Technologies S.A.
Christophe Malville
G01 - MEASURING TESTING
Patents Applications
last 30 patents
Information
Patent Application
EQUIPMENT FOR BONDING BY MOLECULAR ADHESION
Publication number
20090294072
Publication date
Dec 3, 2009
S.O.I.Tec Silicon on Insulator Technologies
Sebastien Kerdiles
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESS FOR BONDING BY MOLECULAR ADHESION
Publication number
20090261064
Publication date
Oct 22, 2009
S.O.I.Tec Silicon on Insulator Technologies
Sebastien Kerdiles
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Process and equipment for bonding by molecular adhesion
Publication number
20070119812
Publication date
May 31, 2007
Sebastien Kerdiles
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLANARIZATION OF A HETEROEPITAXIAL LAYER
Publication number
20070087570
Publication date
Apr 19, 2007
Muriel Martinez
B24 - GRINDING POLISHING
Information
Patent Application
Methods for forming semiconductor structures
Publication number
20060141746
Publication date
Jun 29, 2006
Cecile Delattre
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for recycling a substrate
Publication number
20040112866
Publication date
Jun 17, 2004
Christophe Maleville
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Surface preparation for receiving processing treatments
Publication number
20040058626
Publication date
Mar 25, 2004
Laurent Filipozzi
B24 - GRINDING POLISHING
Information
Patent Application
Device and method for automatically determining the surface quality...
Publication number
20040005727
Publication date
Jan 8, 2004
Christophe Malville
G01 - MEASURING TESTING
Information
Patent Application
Chemical-mechanical polishing machine for polishing a wafer of mate...
Publication number
20030194948
Publication date
Oct 16, 2003
Frederic Metral
B24 - GRINDING POLISHING