Frederick Arellano

Person

Pulo Cabuyao Laguna, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Bottom package exposed die MEMS pressure sensor integrated circuit...
- Patent number 11,355,423
- Issue date Jun 7, 2022
- STMicroelectronics, Inc.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bottom package exposed die MEMS pressure sensor integrated circuit...
- Patent number 10,483,191
- Issue date Nov 19, 2019
- STMicroelectronics, Inc.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic package having electromagnetic interference shielding an...
- Patent number 9,824,979
- Issue date Nov 21, 2017
- STMicroelectronics, Inc.
- Godfrey Dimayuga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a shielded integrated circuit (IC) package with a...
- Patent number 9,761,538
- Issue date Sep 12, 2017
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...
- Publication number 20220285249
- Publication date Sep 8, 2022
- STMICROELECTRONICS, INC.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...
- Publication number 20200020616
- Publication date Jan 16, 2020
- STMICROELECTRONICS, INC.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...
- Publication number 20180016133
- Publication date Jan 18, 2018
- STMICROELECTRONICS, INC.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MAKING A SHIELDED INTEGRATED CIRCUIT (IC) PACKAGE WITH...
- Publication number 20170263566
- Publication date Sep 14, 2017
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING AN...
- Publication number 20170186698
- Publication date Jun 29, 2017
- STMICROELECTRONICS, INC.
- Godfrey DIMAYUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING IC WITH STEPPED SIDEWALL AND RELATED IC DEVICES
- Publication number 20170084490
- Publication date Mar 23, 2017
- STMICROELECTRONICS, INC.
- Bryan Christian Bacquian
- H01 - BASIC ELECTRIC ELEMENTS

Frederick Arellano

Person

Patents Grantslast 30 patents

Bottom package exposed die MEMS pressure sensor integrated circuit...

Bottom package exposed die MEMS pressure sensor integrated circuit...

Electronic package having electromagnetic interference shielding an...

Method for making a shielded integrated circuit (IC) package with a...

Patents Applicationslast 30 patents

BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...

BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...

BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...

METHOD FOR MAKING A SHIELDED INTEGRATED CIRCUIT (IC) PACKAGE WITH...

ELECTRONIC PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING AN...

METHOD FOR MAKING IC WITH STEPPED SIDEWALL AND RELATED IC DEVICES