Frederick ATADANA

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package lids with polymer features
- Patent number 11,935,799
- Issue date Mar 19, 2024
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill flow management in electronic assemblies
- Patent number 11,935,861
- Issue date Mar 19, 2024
- Intel Coropration
- Frederick W. Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC assemblies including die perimeter frames suitable for containin...
- Patent number 11,842,944
- Issue date Dec 12, 2023
- Intel Corporation
- Kyle Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with underfilled sealant
- Patent number 11,710,672
- Issue date Jul 25, 2023
- Intel Corporation
- Taylor William Gaines
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PERMANENT LAYER FOR BUMP CHIP ATTACH
- Publication number 20240178097
- Publication date May 30, 2024
- Intel Corporation
- Frederick Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL
- Publication number 20230378124
- Publication date Nov 23, 2023
- Intel Corporation
- Frederick Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL FLOW MANAGEMENT IN ELECTRONIC ASSEMBLIES
- Publication number 20210343677
- Publication date Nov 4, 2021
- Intel Corporation
- Frederick W. Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC ASSEMBLIES INCLUDING DIE PERIMETER FRAMES SUITABLE FOR CONTAININ...
- Publication number 20210202348
- Publication date Jul 1, 2021
- Intel Corporation
- Kyle Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH UNDERFILLED SEALANT
- Publication number 20210013115
- Publication date Jan 14, 2021
- Intel Corporation
- Taylor William Gaines
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE LIDS WITH POLYMER FEATURES
- Publication number 20200411395
- Publication date Dec 31, 2020
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELECTRONIC PACKAGE WITH BARRIER STRUCTURE
- Publication number 20200006169
- Publication date Jan 2, 2020
- Intel Corporation
- William WARREN
- H01 - BASIC ELECTRIC ELEMENTS

Frederick ATADANA

Person

Patents Grantslast 30 patents

Integrated circuit package lids with polymer features

Underfill flow management in electronic assemblies

IC assemblies including die perimeter frames suitable for containin...

Microelectronic package with underfilled sealant

Patents Applicationslast 30 patents

PERMANENT LAYER FOR BUMP CHIP ATTACH

MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL

UNDERFILL FLOW MANAGEMENT IN ELECTRONIC ASSEMBLIES

IC ASSEMBLIES INCLUDING DIE PERIMETER FRAMES SUITABLE FOR CONTAININ...

MICROELECTRONIC PACKAGE WITH UNDERFILLED SEALANT

INTEGRATED CIRCUIT PACKAGE LIDS WITH POLYMER FEATURES

MICRO-ELECTRONIC PACKAGE WITH BARRIER STRUCTURE