Frederick C. Wu

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and process for plasma-enhanced atomic layer deposition
- Patent number 9,032,906
- Issue date May 19, 2015
- Applied Materials, Inc.
- Paul Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and process for plasma-enhanced atomic layer deposition
- Patent number 7,850,779
- Issue date Dec 14, 2010
- Applied Materisals, Inc.
- Paul Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of recovering valuable material from exhaust gas stream of a...
- Patent number 7,833,358
- Issue date Nov 16, 2010
- Applied Materials, Inc.
- Schubert S. Chu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and process for plasma-enhanced atomic layer deposition
- Patent number 7,682,946
- Issue date Mar 23, 2010
- Applied Materials, Inc.
- Paul Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formation of composite tungsten films
- Patent number 7,605,083
- Issue date Oct 20, 2009
- Applied Materials, Inc.
- Ken K. Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formation of composite tungsten films
- Patent number 7,384,867
- Issue date Jun 10, 2008
- Applied Materials, Inc.
- Ken K. Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formation of composite tungsten films
- Patent number 6,939,804
- Issue date Sep 6, 2005
- Applied Materials, Inc.
- Ken K. Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a thick titanium nitride film
- Patent number 6,548,402
- Issue date Apr 15, 2003
- Applied Materials, Inc.
- Shulin Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a titanium silicide layer on a substrate
- Patent number 6,524,952
- Issue date Feb 25, 2003
- Applied Materials, Inc.
- Ramanujapuram A. Srinivas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer readable medium for controlling a method of cleaning a pro...
- Patent number 6,482,746
- Issue date Nov 19, 2002
- Applied Materials, Inc.
- Anand Vasudev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cleaning a process chamber
- Patent number 6,242,347
- Issue date Jun 5, 2001
- Applied Materials, Inc.
- Anand Vasudev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of performing titanium/titanium nitride integration
- Patent number 6,221,174
- Issue date Apr 24, 2001
- Applied Materials, Inc.
- Fufa Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PROCESS FOR ELECTROLESS COPPER DEPOSITION ON A RUTHENIUM SEED
- Publication number 20120315756
- Publication date Dec 13, 2012
- APPLIED MATERIALS, INC.
- Timothy W. Weidman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20080268171
- Publication date Oct 30, 2008
- PAUL MA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FORMATION OF COMPOSITE TUNGSTEN FILMS
- Publication number 20080227291
- Publication date Sep 18, 2008
- KEN K. LAI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of recovering valuable material from exhaust gas stream of a...
- Publication number 20070235059
- Publication date Oct 11, 2007
- APPLIED MATERIALS, INC.
- Schubert S. Chu
- B08 - CLEANING
Information Patent Application
APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20070128863
- Publication date Jun 7, 2007
- Paul Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20070128864
- Publication date Jun 7, 2007
- Paul Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20070128862
- Publication date Jun 7, 2007
- Paul Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20070119371
- Publication date May 31, 2007
- Paul Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20070119370
- Publication date May 31, 2007
- Paul Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER DEPOSITION PROCESSES FOR RUTHENIUM MATERIALS
- Publication number 20070077750
- Publication date Apr 5, 2007
- Paul Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER DEPOSITION PROCESSES FOR RUTHENIUM MATERIALS
- Publication number 20070054487
- Publication date Mar 8, 2007
- APPLIED MATERIALS, INC.
- PAUL MA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Process for electroless copper deposition on a ruthenium seed
- Publication number 20060246699
- Publication date Nov 2, 2006
- Timothy W. Weidman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Formation of composite tungsten films
- Publication number 20050287807
- Publication date Dec 29, 2005
- APPLIED MATERIALS, INC.
- Ken K. Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Formation of composite tungsten films
- Publication number 20040014315
- Publication date Jan 22, 2004
- APPLIED MATERIALS, INC.
- Ken K. Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of titanium and titanium nitride layer deposition
- Publication number 20030072884
- Publication date Apr 17, 2003
- APPLIED MATERIALS, INC.
- Tong Zhang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Formation of refractory metal nitrides using chemisorption techniques
- Publication number 20030049931
- Publication date Mar 13, 2003
- APPLIED MATERIALS, INC.
- Jeong Soo Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITING A THICK TITANIUM NITRIDE FILM
- Publication number 20020064598
- Publication date May 30, 2002
- SHULIN WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for cleaning a process chamber
- Publication number 20010027030
- Publication date Oct 4, 2001
- APPLIED MATERIALS, INC.
- Anand Vasudev
- H01 - BASIC ELECTRIC ELEMENTS

Frederick C. Wu

Person

Patents Grantslast 30 patents

Apparatus and process for plasma-enhanced atomic layer deposition

Apparatus and process for plasma-enhanced atomic layer deposition

Method of recovering valuable material from exhaust gas stream of a...

Apparatus and process for plasma-enhanced atomic layer deposition

Formation of composite tungsten films

Formation of composite tungsten films

Formation of composite tungsten films

Method of depositing a thick titanium nitride film

Method of forming a titanium silicide layer on a substrate

Computer readable medium for controlling a method of cleaning a pro...

Method for cleaning a process chamber

Method of performing titanium/titanium nitride integration

Patents Applicationslast 30 patents

PROCESS FOR ELECTROLESS COPPER DEPOSITION ON A RUTHENIUM SEED

APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION

FORMATION OF COMPOSITE TUNGSTEN FILMS

Method of recovering valuable material from exhaust gas stream of a...

APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION

APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION

APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION

APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION

APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION

ATOMIC LAYER DEPOSITION PROCESSES FOR RUTHENIUM MATERIALS

ATOMIC LAYER DEPOSITION PROCESSES FOR RUTHENIUM MATERIALS

Process for electroless copper deposition on a ruthenium seed

Formation of composite tungsten films

Formation of composite tungsten films

Method of titanium and titanium nitride layer deposition

Formation of refractory metal nitrides using chemisorption techniques

METHOD OF DEPOSITING A THICK TITANIUM NITRIDE FILM

Method for cleaning a process chamber