Frederick Cruz Santos

Follow

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package-in-package system housing a plurality of...
- Patent number 8,946,878
- Issue date Feb 3, 2015
- Stats Chippac Ltd.
- Chee Keong Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with stacked devices
- Patent number 8,018,039
- Issue date Sep 13, 2011
- Stats Chippac Ltd.
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKED DEVICES
- Publication number 20090224389
- Publication date Sep 10, 2009
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
- Publication number 20090146271
- Publication date Jun 11, 2009
- Chee Keong Chin
- H01 - BASIC ELECTRIC ELEMENTS