Frederick Ray Gomez

Person

Iligan City, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Lead stabilization in semiconductor packages
- Patent number 12,211,774
- Issue date Jan 28, 2025
- STMicroelectronics, Inc.
- Ela Mia Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 12,094,725
- Issue date Sep 17, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 11,227,776
- Issue date Jan 18, 2022
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection from ESD during the manufacturing process of semiconduct...
- Patent number 10,672,689
- Issue date Jun 2, 2020
- STMicroelectronics, Inc.
- Frederick Ray Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection from ESD during the manufacturing process of semiconduct...
- Patent number 10,388,594
- Issue date Aug 20, 2019
- STMicroelectronics, Inc.
- Frederick Ray Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 9,578,744
- Issue date Feb 21, 2017
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support structure for stacked integrated circuit dies
- Patent number 9,258,890
- Issue date Feb 9, 2016
- STMicroelectronics, Inc.
- Rammil Seguido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LEADFRAME PACKAGE WITH PRE-APPLIED FILLER MATERIAL
- Publication number 20220102166
- Publication date Mar 31, 2022
- STMICROELECTRONICS, INC.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD STABILIZATION IN SEMICONDUCTOR PACKAGES
- Publication number 20200343168
- Publication date Oct 29, 2020
- STMicroelectronics, Inc.
- Ela Mia CADAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION FROM ESD DURING THE MANUFACTURING PROCESS OF SEMICONDUCT...
- Publication number 20190326201
- Publication date Oct 24, 2019
- STMICROELECTRONICS, INC.
- Frederick Ray GOMEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION FROM ESD DURING THE MANUFACTURING PROCESS OF SEMICONDUCT...
- Publication number 20190006266
- Publication date Jan 3, 2019
- STMICROELECTRONICS, INC.
- Frederick Ray GOMEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE WITH PRE-APPLIED FILLER MATERIAL
- Publication number 20170110340
- Publication date Apr 20, 2017
- STMICROELECTRONICS, INC.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE WITH PRE-APPLIED FILLER MATERIAL
- Publication number 20160183369
- Publication date Jun 23, 2016
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT STRUCTURE FOR STACKED INTEGRATED CIRCUIT DIES
- Publication number 20150351234
- Publication date Dec 3, 2015
- STMicroelectronics, Inc.
- Rammil Seguido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Frederick Ray Gomez

Person

Patents Grantslast 30 patents

Lead stabilization in semiconductor packages

Leadframe package with pre-applied filler material

Leadframe package with pre-applied filler material

Protection from ESD during the manufacturing process of semiconduct...

Protection from ESD during the manufacturing process of semiconduct...

Leadframe package with pre-applied filler material

Support structure for stacked integrated circuit dies

Patents Applicationslast 30 patents

LEADFRAME PACKAGE WITH PRE-APPLIED FILLER MATERIAL

LEAD STABILIZATION IN SEMICONDUCTOR PACKAGES

PROTECTION FROM ESD DURING THE MANUFACTURING PROCESS OF SEMICONDUCT...

PROTECTION FROM ESD DURING THE MANUFACTURING PROCESS OF SEMICONDUCT...

LEADFRAME PACKAGE WITH PRE-APPLIED FILLER MATERIAL

LEADFRAME PACKAGE WITH PRE-APPLIED FILLER MATERIAL

SUPPORT STRUCTURE FOR STACKED INTEGRATED CIRCUIT DIES