Friedrich Lupp

Follow

Person

Munchen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Planar electrical power electronic modules for high-temperature app...
- Patent number 8,570,748
- Issue date Oct 29, 2013
- Siemens Aktiengesellschaft
- Friedrich Lupp
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for producing an encapsulation for a SAW component operating...
- Patent number 6,446,316
- Issue date Sep 10, 2002
- Siemens Matsushita Components GmbH & Co. KG
- Bruno Fürbacher
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Encapsulation for electronic components and method for producing th...
- Patent number 5,831,369
- Issue date Nov 3, 1998
- Siemens Matsushita Components GmbH & Co. KG
- Bruno Furbacher
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
Method for Welding an Attachment Piece to a Semiconductor Metallisa...
- Publication number 20230207516
- Publication date Jun 29, 2023
- SIEMENS AKTIENGESELLSCHAFT
- Markus Lasch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR SELECTIVE LASER MELTING AND SYSTEM FOR CARRYING OUT SAI...
- Publication number 20140131921
- Publication date May 15, 2014
- SIEMENS AKTIENGESELLSCHAFT
- Yves Küsters
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PLANAR ELECTRICAL POWER ELECTRONIC MODULES FOR HIGH-TEMPERATURE APP...
- Publication number 20110107594
- Publication date May 12, 2011
- Friedrich Lupp
- H01 - BASIC ELECTRIC ELEMENTS