Friedrich Paul Lindner

Person

Scharding, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Device and method for bonding substrates
- Patent number 11,697,281
- Issue date Jul 11, 2023
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device and method for embossing micro- and/or nanostructures
- Patent number 11,472,212
- Issue date Oct 18, 2022
- EV Group E. Thallner GmbH
- Friedrich Paul Lindner
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for prefixing of substrates
- Patent number 11,328,939
- Issue date May 10, 2022
- EV Group E. Thallner GmbH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,059,280
- Issue date Jul 13, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,020,950
- Issue date Jun 1, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,020,953
- Issue date Jun 1, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,020,952
- Issue date Jun 1, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,020,951
- Issue date Jun 1, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for bonding substrates
- Patent number 10,971,378
- Issue date Apr 6, 2021
- EV Group E. Thallner GmbH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for prefixing of substrates
- Patent number 10,438,822
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Receptacle device, device and method for handling substrate stacks
- Patent number 10,347,523
- Issue date Jul 9, 2019
- EV Group E. Thallner GmbH
- Erich Thallner
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Device for prefixing of substrates
- Patent number 10,340,161
- Issue date Jul 2, 2019
- EV Group E. Thallner GmbH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 10,279,575
- Issue date May 7, 2019
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for embossing of substrates
- Patent number 10,239,253
- Issue date Mar 26, 2019
- EV Group E. Thallner GmbH
- Friedrich Paul Lindner
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method and device for bonding substrates
- Patent number 10,014,193
- Issue date Jul 3, 2018
- EV Group E. Thallner GmbH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for leveling a substrate stack
- Patent number 9,984,942
- Issue date May 29, 2018
- EV Group E. Thallner GmbH
- Jurgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Receptacle device, device and method for handling substrate stacks
- Patent number 9,941,149
- Issue date Apr 10, 2018
- EV Group E. Thallner GmbH
- Erich Thallner
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Device and method for processing of wafers
- Patent number 9,771,223
- Issue date Sep 26, 2017
- EV Group GmbH
- Friedrich Paul Lindner
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Device and method for processing wafers
- Patent number 9,751,698
- Issue date Sep 5, 2017
- EV Group GmbH
- Friedrich Paul Lindner
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Receptacle device, device and method for handling substrate stacks
- Patent number 9,666,470
- Issue date May 30, 2017
- EV Group E. Thallner GmbH
- Erich Thallner
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Semiconductor treating device and method
- Patent number 9,653,329
- Issue date May 16, 2017
- EV Group E. Thallner GmbH
- Friedrich Paul Lindner
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for detaching a product substrate off a carrier substrate
- Patent number 9,457,552
- Issue date Oct 4, 2016
- EV Group GmbH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device for aligning and pre-fixing a wafer
- Patent number 9,449,863
- Issue date Sep 20, 2016
- EV Group GmbH
- Jurgen Burggraf
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Device for detaching a product substrate off a carrier substrate
- Patent number 9,381,729
- Issue date Jul 5, 2016
- EV Group GmbH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device for stripping a product substrate from a carrier substrate
- Patent number 9,381,732
- Issue date Jul 5, 2016
- EV Group GmbH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device for detaching a product substrate off a carrier substrate
- Patent number 9,272,501
- Issue date Mar 1, 2016
- EV Group GmbH
- Jurgen Burggraf
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for stripping a product substrate from a carrier substrate
- Patent number 9,186,877
- Issue date Nov 17, 2015
- EV Group GmbH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device for separating a substrate from a carrier substrate
- Patent number 9,138,978
- Issue date Sep 22, 2015
- EV Group GmbH
- Markus Wimplinger
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device for embossing of substrates
- Patent number 9,116,424
- Issue date Aug 25, 2015
- EV Group E. Thallner GmbH
- Friedrich Paul Lindner
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Device and method for stripping a product substrate from a carrier...
- Patent number 8,986,496
- Issue date Mar 24, 2015
- EV Group GmbH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20230294390
- Publication date Sep 21, 2023
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE AND METHOD FOR THE ALIGNMENT OF SUBSTRATES
- Publication number 20230207513
- Publication date Jun 29, 2023
- EV GROUP E. THALLNER GMBH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SINGULATED ENCAPSULATED COMPONENTS
- Publication number 20230015545
- Publication date Jan 19, 2023
- EV GROUP E. THALLNER GMBH
- Gerald MITTENDORFER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR EMBOSSING MICRO- AND/OR NANOSTRUCTURES
- Publication number 20230001723
- Publication date Jan 5, 2023
- EV GROUP E. THALLNER GMBH
- Friedrich Paul Lindner
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD FOR PREFIXING OF SUBSTRATES
- Publication number 20220230849
- Publication date Jul 21, 2022
- EV GROUP E. THALLNER GMBH
- Friedrich Paul Lindner
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20210291504
- Publication date Sep 23, 2021
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND DEVICE FOR BONDING SUBSTRATES
- Publication number 20210183666
- Publication date Jun 17, 2021
- EV GROUP E. THALLNER GMBH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREFIXING OF SUBSTRATES
- Publication number 20190385870
- Publication date Dec 19, 2019
- EV GROUP E. THALLNER GMBH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190217594
- Publication date Jul 18, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190217595
- Publication date Jul 18, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190210348
- Publication date Jul 11, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190210349
- Publication date Jul 11, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190210350
- Publication date Jul 11, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREFIXING OF SUBSTRATES
- Publication number 20190198362
- Publication date Jun 27, 2019
- EV GROUP E. THALLNER GMBH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR EMBOSSING MICRO- AND/OR NANOSTRUCTURES
- Publication number 20190176500
- Publication date Jun 13, 2019
- EV GROUP E. THALLNER GMBH
- Friedrich Paul Lindner
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD AND DEVICE FOR BONDING SUBSTRATES
- Publication number 20180277403
- Publication date Sep 27, 2018
- EV GROUP E. THALLNER GMBH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECEPTACLE DEVICE, DEVICE AND METHOD FOR HANDLING SUBSTRATE STACKS
- Publication number 20180190536
- Publication date Jul 5, 2018
- EV GROUP E. THALLNER GMBH
- Erich THALLNER
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
METHOD AND DEVICE FOR PREFIXING OF SUBSTRATES
- Publication number 20170345690
- Publication date Nov 30, 2017
- EV GROUP E. THALLNER GMBH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECEPTACLE DEVICE, DEVICE AND METHOD FOR HANDLING SUBSTRATE STACKS
- Publication number 20170229336
- Publication date Aug 10, 2017
- EV GROUP E. THALLNER GMBH
- Erich THALLNER
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
METHOD AND DEVICE FOR LEVELING A SUBSTRATE STACK
- Publication number 20170110377
- Publication date Apr 20, 2017
- EV GROUP E. THALLNER GMBH
- Jurgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR BONDING SUBSTRATES
- Publication number 20160336203
- Publication date Nov 17, 2016
- EV GROUP E. THALLNER GMBH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECEPTACLE DEVICE, DEVICE AND METHOD FOR HANDLING SUBSTRATE STACKS
- Publication number 20160020136
- Publication date Jan 21, 2016
- EV GROUP E. THALLNER GMBH
- Erich THALLNER
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
SEMICONDUCTOR TREATING DEVICE AND METHOD
- Publication number 20150262849
- Publication date Sep 17, 2015
- EV GROUP E. THALLNER GMBH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR EMBOSSING OF SUBSTRATES
- Publication number 20150251349
- Publication date Sep 10, 2015
- EV Group E. Thallner GmbH
- Friedrich Paul Lindner
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR DETACHING A PRODUCT SUBSTRATE OFF A CARRIER SUBSTRATE
- Publication number 20150251404
- Publication date Sep 10, 2015
- EV Group GmbH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER SUBSTRATE
- Publication number 20150096690
- Publication date Apr 9, 2015
- EV GROUP GMBH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE FOR ALIGNING AND PRE-FIXING A WAFER
- Publication number 20150089783
- Publication date Apr 2, 2015
- EV Group GmbH
- Jurgen BURGGRAF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER SUBSTRATE
- Publication number 20150075725
- Publication date Mar 19, 2015
- EV GROUP GMBH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER...
- Publication number 20130340947
- Publication date Dec 26, 2013
- EV GROUP GMBH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR PROCESSING OF WAFERS
- Publication number 20130309046
- Publication date Nov 21, 2013
- EV Group GmbH
- Friedrich Paul Lindner
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Friedrich Paul Lindner

Person

Patents Grantslast 30 patents

Device and method for bonding substrates

Device and method for embossing micro- and/or nanostructures

Method for prefixing of substrates

Device and method for bonding substrates

Device and method for bonding substrates

Device and method for bonding substrates

Device and method for bonding substrates

Device and method for bonding substrates

Method and device for bonding substrates

Method for prefixing of substrates

Receptacle device, device and method for handling substrate stacks

Device for prefixing of substrates

Device and method for bonding substrates

Method for embossing of substrates

Method and device for bonding substrates

Method and device for leveling a substrate stack

Receptacle device, device and method for handling substrate stacks

Device and method for processing of wafers

Device and method for processing wafers

Receptacle device, device and method for handling substrate stacks

Semiconductor treating device and method

Method for detaching a product substrate off a carrier substrate

Device for aligning and pre-fixing a wafer

Device for detaching a product substrate off a carrier substrate

Device for stripping a product substrate from a carrier substrate

Device for detaching a product substrate off a carrier substrate

Method for stripping a product substrate from a carrier substrate

Device for separating a substrate from a carrier substrate

Device for embossing of substrates

Device and method for stripping a product substrate from a carrier...

Patents Applicationslast 30 patents

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR THE ALIGNMENT OF SUBSTRATES

METHOD FOR PRODUCING SINGULATED ENCAPSULATED COMPONENTS

DEVICE AND METHOD FOR EMBOSSING MICRO- AND/OR NANOSTRUCTURES

METHOD FOR PREFIXING OF SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

METHOD AND DEVICE FOR BONDING SUBSTRATES

METHOD FOR PREFIXING OF SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

METHOD FOR PREFIXING OF SUBSTRATES

DEVICE AND METHOD FOR EMBOSSING MICRO- AND/OR NANOSTRUCTURES

METHOD AND DEVICE FOR BONDING SUBSTRATES

RECEPTACLE DEVICE, DEVICE AND METHOD FOR HANDLING SUBSTRATE STACKS

METHOD AND DEVICE FOR PREFIXING OF SUBSTRATES

RECEPTACLE DEVICE, DEVICE AND METHOD FOR HANDLING SUBSTRATE STACKS

METHOD AND DEVICE FOR LEVELING A SUBSTRATE STACK

METHOD AND DEVICE FOR BONDING SUBSTRATES

RECEPTACLE DEVICE, DEVICE AND METHOD FOR HANDLING SUBSTRATE STACKS

SEMICONDUCTOR TREATING DEVICE AND METHOD

METHOD FOR EMBOSSING OF SUBSTRATES

METHOD FOR DETACHING A PRODUCT SUBSTRATE OFF A CARRIER SUBSTRATE

METHOD FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER SUBSTRATE

DEVICE FOR ALIGNING AND PRE-FIXING A WAFER

DEVICE FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER SUBSTRATE

DEVICE AND METHOD FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER...

DEVICE AND METHOD FOR PROCESSING OF WAFERS