Friedrich Wanninger

Follow

Person

Munchen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Encasing arrangement for a semiconductor component
- Patent number 7,208,827
- Issue date Apr 24, 2007
- Infineon Technologies AG
- Christian Hauser
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Encasing arrangement for a semicoductor component
- Publication number 20050040517
- Publication date Feb 24, 2005
- Christian Hauser
- H01 - BASIC ELECTRIC ELEMENTS