Fu-Bin Song

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Tianjin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Flip chip and wire bond semiconductor package
- Patent number 7,554,185
- Issue date Jun 30, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Flip Chip And Wire Bond Semiconductor Package
- Publication number 20080111248
- Publication date May 15, 2008
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN package and method therefor
- Publication number 20060038266
- Publication date Feb 23, 2006
- Fu-Bin Song
- H01 - BASIC ELECTRIC ELEMENTS