Fu Cheng CHEN

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Patents Grantslast 30 patents

Information Patent Grant
Packaging structure
- Patent number 11,462,440
- Issue date Oct 4, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jian Gang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and fabrication methods thereof
- Patent number 10,685,831
- Issue date Jun 16, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fu Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and fabrication method thereof
- Patent number 10,672,662
- Issue date Jun 2, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jian Gang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding methods and wafer-bonded structures
- Patent number 10,446,519
- Issue date Oct 15, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jin Guang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding structure and wafer bonding method
- Patent number 10,121,762
- Issue date Nov 6, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fu Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING STRUCTURE
- Publication number 20200258781
- Publication date Aug 13, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jian Gang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20190035686
- Publication date Jan 31, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jian Gang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS THEREOF
- Publication number 20180337038
- Publication date Nov 22, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fu Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHODS AND WAFER-BONDED STRUCTURES
- Publication number 20180269178
- Publication date Sep 20, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jin Guang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING STRUCTURE AND WAFER BONDING METHOD
- Publication number 20180151535
- Publication date May 31, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fu Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS