Fu-Jier Fan

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and manufacturing method of the same
- Patent number 12,272,686
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fu-Jier Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming thereof
- Patent number 12,100,706
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jhu-Min Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 11,710,712
- Issue date Jul 25, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jhu-Min Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via design for stacking integrated circuits
- Patent number 11,705,449
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via design for stacking integrated circuits
- Patent number 11,646,308
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dishing prevention dummy structures for semiconductor devices
- Patent number 11,569,363
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,417,649
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming thereof
- Patent number 11,410,995
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jhu-Min Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage integration for HKMG technology
- Patent number 11,302,691
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via design for stacking integrated circuits
- Patent number 11,063,038
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed STI as the gate dielectric of HV device
- Patent number 11,004,844
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via design for stacking integrated circuits
- Patent number 10,964,692
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dishing prevention dummy structures for semiconductor devices
- Patent number 10,950,708
- Issue date Mar 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,937,785
- Issue date Mar 2, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer structure and manufacturing method thereof
- Patent number 10,937,891
- Issue date Mar 2, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fu-Jier Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed STI as the gate dielectric of HV device
- Patent number 10,916,542
- Issue date Feb 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer structure and manufacturing method thereof
- Patent number 10,868,141
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fu-Jier Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage integration for HKMG technology
- Patent number 10,790,279
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via design for stacking integrated circuits
- Patent number 10,629,592
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dishing prevention dummy structures for semiconductor devices
- Patent number 10,516,029
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage integration for HKMG technology
- Patent number 10,510,750
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dishing prevention dummy structures for semiconductor devices
- Patent number 10,340,357
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
OLED merged spacer device
- Patent number 10,325,964
- Issue date Jun 18, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for forming the same
- Patent number 10,164,037
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ker-Hsiao Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage integration for HKMG technology
- Patent number 10,050,033
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating grid and crown-shaping poly for improving ILD CMP dishing
- Patent number 9,853,149
- Issue date Dec 26, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Hsuing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling well structure for improving HVMOS performance
- Patent number 9,111,957
- Issue date Aug 18, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsueh-Liang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling well structure for improving HVMOS performance
- Patent number 8,592,923
- Issue date Nov 26, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsueh-Liang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling well structure for improving HVMOS performance
- Patent number 8,049,295
- Issue date Nov 1, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsueh-Liang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Colors only process to reduce package yield loss
- Patent number 7,816,169
- Issue date Oct 19, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240371865
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JHU-MIN SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230317656
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JHU-MIN SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF
- Publication number 20220367452
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- JHU-MIN SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20220359502
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-SHENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20220352044
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- FU-JIER FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS
- Publication number 20220302108
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20220216169
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- JHU-MIN SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS
- Publication number 20210343707
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Recessed STI as the Gate Dielectric of HV Device
- Publication number 20210280577
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISHING PREVENTION DUMMY STRUCTURES FOR SEMICONDUCTOR DEVICES
- Publication number 20210193813
- Publication date Jun 24, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE INTEGRATION FOR HKMG TECHNOLOGY
- Publication number 20200402978
- Publication date Dec 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS
- Publication number 20200243516
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISHING PREVENTION DUMMY STRUCTURES FOR SEMICONDUCTOR DEVICES
- Publication number 20200083343
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE INTEGRATION FOR HKMG TECHNOLOGY
- Publication number 20200051975
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS
- Publication number 20200035672
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS
- Publication number 20190363079
- Publication date Nov 28, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISHING PREVENTION DUMMY STRUCTURES FOR SEMICONDUCTOR DEVICES
- Publication number 20190296121
- Publication date Sep 26, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISHING PREVENTION DUMMY STRUCTURES FOR SEMICONDUCTOR DEVICES
- Publication number 20190097013
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190096882
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-SHENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE INTEGRATION FOR HKMG TECHNOLOGY
- Publication number 20190081041
- Publication date Mar 14, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Recessed STI as the Gate Dielectric of HV Device
- Publication number 20180350801
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180337249
- Publication date Nov 22, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- Fu-Jier FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20180286960
- Publication date Oct 4, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ker-Hsiao HUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OLED MERGED SPACER DEVICE
- Publication number 20180138250
- Publication date May 17, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170221883
- Publication date Aug 3, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-SHENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170194455
- Publication date Jul 6, 2017
- FU-JIER FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Recessed STI as the Gate Dielectric of HV Device
- Publication number 20170194320
- Publication date Jul 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coupling Well Structure for Improving HVMOS Performance
- Publication number 20140045304
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsueh-Liang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coupling Well Structure for Improving HVMOS Performance
- Publication number 20120037987
- Publication date Feb 16, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsueh-Liang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coupling Well Structure for Improving HVMOS Performance
- Publication number 20110006366
- Publication date Jan 13, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsueh-Liang Chou
- H01 - BASIC ELECTRIC ELEMENTS

Fu-Jier Fan

Person

Patents Grantslast 30 patents

Semiconductor structure and manufacturing method of the same

Semiconductor structure and method of forming thereof

Semiconductor device and manufacturing method of the same

Through silicon via design for stacking integrated circuits

Through silicon via design for stacking integrated circuits

Dishing prevention dummy structures for semiconductor devices

Semiconductor device

Semiconductor structure and method of forming thereof

High voltage integration for HKMG technology

Through silicon via design for stacking integrated circuits

Recessed STI as the gate dielectric of HV device

Through silicon via design for stacking integrated circuits

Dishing prevention dummy structures for semiconductor devices

Semiconductor device

Spacer structure and manufacturing method thereof

Recessed STI as the gate dielectric of HV device

Spacer structure and manufacturing method thereof

High voltage integration for HKMG technology

Through silicon via design for stacking integrated circuits

Dishing prevention dummy structures for semiconductor devices

High voltage integration for HKMG technology

Dishing prevention dummy structures for semiconductor devices

OLED merged spacer device

Semiconductor device structure and method for forming the same

High voltage integration for HKMG technology

Floating grid and crown-shaping poly for improving ILD CMP dishing

Coupling well structure for improving HVMOS performance

Coupling well structure for improving HVMOS performance

Coupling well structure for improving HVMOS performance

Colors only process to reduce package yield loss

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME

THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS

Recessed STI as the Gate Dielectric of HV Device

DISHING PREVENTION DUMMY STRUCTURES FOR SEMICONDUCTOR DEVICES

HIGH VOLTAGE INTEGRATION FOR HKMG TECHNOLOGY

THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS

DISHING PREVENTION DUMMY STRUCTURES FOR SEMICONDUCTOR DEVICES

HIGH VOLTAGE INTEGRATION FOR HKMG TECHNOLOGY

THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS

THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS

DISHING PREVENTION DUMMY STRUCTURES FOR SEMICONDUCTOR DEVICES

DISHING PREVENTION DUMMY STRUCTURES FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE

HIGH VOLTAGE INTEGRATION FOR HKMG TECHNOLOGY

Recessed STI as the Gate Dielectric of HV Device

SPACER STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

OLED MERGED SPACER DEVICE

SEMICONDUCTOR DEVICE

SPACER STRUCTURE AND MANUFACTURING METHOD THEREOF

Recessed STI as the Gate Dielectric of HV Device

Coupling Well Structure for Improving HVMOS Performance

Coupling Well Structure for Improving HVMOS Performance

Coupling Well Structure for Improving HVMOS Performance