Fu-Kang LEE

Person

New Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Mechanical couplings designed to resolve process constraints
- Patent number 12,040,197
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single wavelength reflection for leadframe brightness measurement
- Patent number 11,421,981
- Issue date Aug 23, 2022
- Texas Instruments Incorporated
- Hung-Yu Chou
- G01 - MEASURING TESTING
Information Patent Grant
Angled die pad of a leadframe for a molded integrated circuit package
- Patent number 10,957,631
- Issue date Mar 23, 2021
- Texas Instruments Incorporated
- Chung-Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond clamp design and lead frame capable of engaging with same
- Patent number 10,861,777
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single wavelength reflection for leadframe brightness measurement
- Patent number 10,429,174
- Issue date Oct 1, 2019
- Texas Instruments Incorporated
- Hung-Yu Chou
- G01 - MEASURING TESTING
Information Patent Grant
Mechanical couplings designed to resolve process constraints
- Patent number 10,340,152
- Issue date Jul 2, 2019
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS
- Publication number 20210375640
- Publication date Dec 2, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANGLED DIE PAD OF A LEADFRAME FOR A MOLDED INTEGRATED CIRCUIT PACKAGE
- Publication number 20200194345
- Publication date Jun 18, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Chung-Ming CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE WAVELENGTH REFLECTION FOR LEADFRAME BRIGHTNESS MEASUREMENT
- Publication number 20200003548
- Publication date Jan 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Hung-Yu CHOU
- G01 - MEASURING TESTING
Information Patent Application
MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS
- Publication number 20190326131
- Publication date Oct 24, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS
- Publication number 20190206699
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND CLAMP DESIGN AND LEAD FRAME CAPABLE OF ENGAGING WITH SAME
- Publication number 20190206769
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE WAVELENGTH REFLECTION FOR LEADFRAME BRIGHTNESS MEASUREMENT
- Publication number 20190186897
- Publication date Jun 20, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Hung-Yu CHOU
- G01 - MEASURING TESTING

Fu-Kang LEE

Person

Patents Grantslast 30 patents

Mechanical couplings designed to resolve process constraints

Single wavelength reflection for leadframe brightness measurement

Angled die pad of a leadframe for a molded integrated circuit package

Wire bond clamp design and lead frame capable of engaging with same

Single wavelength reflection for leadframe brightness measurement

Mechanical couplings designed to resolve process constraints

Patents Applicationslast 30 patents

MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS

ANGLED DIE PAD OF A LEADFRAME FOR A MOLDED INTEGRATED CIRCUIT PACKAGE

SINGLE WAVELENGTH REFLECTION FOR LEADFRAME BRIGHTNESS MEASUREMENT

MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS

MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS

WIRE BOND CLAMP DESIGN AND LEAD FRAME CAPABLE OF ENGAGING WITH SAME

SINGLE WAVELENGTH REFLECTION FOR LEADFRAME BRIGHTNESS MEASUREMENT