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Austin, TX, US
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Patents Grants
last 30 patents
Information
Patent Grant
Fan-out package with reinforcing rivets
Patent number
11,742,301
Issue date
Aug 29, 2023
Advanced Micro Devices, Inc.
Rahul Agarwal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip with reduced pitch conductive pillars
Patent number
11,676,924
Issue date
Jun 13, 2023
Advanced Micro Devices, Inc.
Priyal Shah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid bonded interconnect bridging
Patent number
11,676,940
Issue date
Jun 13, 2023
Advanced Micro Devices, Inc.
Lei Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded chip package with anchor structures
Patent number
11,367,628
Issue date
Jun 21, 2022
Advanced Micro Devices, Inc.
Priyal Shah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip with solder cap probe test pads
Patent number
11,309,222
Issue date
Apr 19, 2022
Advanced Micro Devices, Inc.
Lei Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip with reduced pitch conductive pillars
Patent number
10,943,880
Issue date
Mar 9, 2021
Advanced Micro Devices, Inc.
Priyal Shah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-RDL structure packages and methods of fabricating the same
Patent number
10,903,168
Issue date
Jan 26, 2021
Advanced Micro Devices, Inc.
Milind S. Bhagavat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-RDL structure packages and methods of fabricating the same
Patent number
10,672,712
Issue date
Jun 2, 2020
Advanced Micro Devices, Inc.
Milind S. Bhagavat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded chip combination
Patent number
10,510,721
Issue date
Dec 17, 2019
Advanced Micro Devices, Inc.
Milind S. Bhagavat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked semiconductor chips packaging
Patent number
9,449,907
Issue date
Sep 20, 2016
Advanced Micro Devices, Inc.
Lei Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor workpiece with backside metallization and methods of...
Patent number
8,723,314
Issue date
May 13, 2014
Advanced Micro Devices, Inc.
Michael Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip device with underfill
Patent number
8,691,626
Issue date
Apr 8, 2014
Advanced Micro Devices, Inc.
Michael Z. Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package having offset vias
Patent number
8,624,404
Issue date
Jan 7, 2014
Advanced Micro Devices, Inc.
Michael Z. Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip with protective scribe structure
Patent number
8,293,581
Issue date
Oct 23, 2012
GLOBALFOUNDRIES Inc.
Michael Z. Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive connection structure with stress reduction arrangement f...
Patent number
8,293,636
Issue date
Oct 23, 2012
GLOBALFOUNDRIES, INC.
Thomas Schulze
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices having stress relief layers and methods for f...
Patent number
7,977,160
Issue date
Jul 12, 2011
GLOBALFOUNDRIES, INC.
Michael Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip with reinforcement structure
Patent number
7,737,563
Issue date
Jun 15, 2010
GLOBALFOUNDRIES Inc.
Michael Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip with crack stop
Patent number
7,679,200
Issue date
Mar 16, 2010
GLOBALFOUNDRIES Inc.
Michael Z. Su
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
HYBRID BONDED INTERCONNECT BRIDGING
Publication number
20230387076
Publication date
Nov 30, 2023
ADVANCED MICRO DEVICES, INC.
LEI FU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDED CHIP PACKAGE WITH ANCHOR STRUCTURES
Publication number
20220319871
Publication date
Oct 6, 2022
ADVANCED MICRO DEVICES, INC.
PRIYAL SHAH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID BONDED INTERCONNECT BRIDGING
Publication number
20220052023
Publication date
Feb 17, 2022
ADVANCED MICRO DEVICES, INC.
LEI FU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP WITH REDUCED PITCH CONDUCTIVE PILLARS
Publication number
20210193604
Publication date
Jun 24, 2021
ADVANCED MICRO DEVICES, INC.
PRIYAL SHAH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP WITH SOLDER CAP PROBE TEST PADS
Publication number
20210066144
Publication date
Mar 4, 2021
ADVANCED MICRO DEVICES, INC.
Lei Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT PACKAGE WITH REINFORCING RIVETS
Publication number
20210057352
Publication date
Feb 25, 2021
ADVANCED MICRO DEVICES, INC.
Rahul Agarwal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDED CHIP PACKAGE WITH ANCHOR STRUCTURES
Publication number
20210020459
Publication date
Jan 21, 2021
ADVANCED MICRO DEVICES, INC.
Priyal Shah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP WITH REDUCED PITCH CONDUCTIVE PILLARS
Publication number
20200365543
Publication date
Nov 19, 2020
ADVANCED MICRO DEVICES, INC.
Priyal Shah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-RDL STRUCTURE PACKAGES AND METHODS OF FABRICATING THE SAME
Publication number
20200294923
Publication date
Sep 17, 2020
ADVANCED MICRO DEVICES, INC.
Milind S. Bhagavat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-RDL STRUCTURE PACKAGES AND METHODS OF FABRICATING THE SAME
Publication number
20200035606
Publication date
Jan 30, 2020
Milind S. Bhagavat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY FAN-OUT PACKAGING
Publication number
20190326257
Publication date
Oct 24, 2019
Rahul Agarwal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDED CHIP COMBINATION
Publication number
20190051633
Publication date
Feb 14, 2019
Milind S. Bhagavat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SEMICONDUCTOR CHIPS PACKAGING
Publication number
20150279773
Publication date
Oct 1, 2015
Advanced Micro Devices, Inc.
Lei Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP WITH EXPANSIVE UNDERBUMP METALLIZATION STRUCTURES
Publication number
20130341785
Publication date
Dec 26, 2013
Lei Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING OFFSET VIAS
Publication number
20130341802
Publication date
Dec 26, 2013
Advanced Micro Devices, Inc.
Michael Z. Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR WORKPIECE WITH BACKSIDE METALLIZATION AND METHODS OF...
Publication number
20130221517
Publication date
Aug 29, 2013
Michael Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SEMICONDUCTOR CHIPS PACKAGING
Publication number
20120193788
Publication date
Aug 2, 2012
Advanced Micro Devices, Inc.
Lei Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP DEVICE WITH UNDERFILL
Publication number
20120061853
Publication date
Mar 15, 2012
Michael Z. Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE CONNECTION STRUCTURE WITH STRESS REDUCTION ARRANGEMENT F...
Publication number
20120049343
Publication date
Mar 1, 2012
Advanced Micro Devices, Inc.
Thomas Schulze
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES HAVING STRESS RELIEF LAYERS AND METHODS FOR F...
Publication number
20110031603
Publication date
Feb 10, 2011
GLOBALFOUNDRIES INC.
Michael SU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Chip with Protective Scribe Structure
Publication number
20100207250
Publication date
Aug 19, 2010
Michael Z. Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Chip with Reinforcement Structure
Publication number
20090302427
Publication date
Dec 10, 2009
Michael Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Chip with Crack Stop
Publication number
20090065952
Publication date
Mar 12, 2009
Michael Z. Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF SAWING SEMICONDUCTOR DEVICE
Publication number
20080191318
Publication date
Aug 14, 2008
Advanced Micro Devices, Inc.
Michael Zhuoying Su
B28 - WORKING CEMENT, CLAY, OR STONE