Fu Lei

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hybrid bonded interconnect bridging
- Patent number 12,107,075
- Issue date Oct 1, 2024
- Advanced Micro Devices, Inc.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package with reinforcing rivets
- Patent number 11,742,301
- Issue date Aug 29, 2023
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with reduced pitch conductive pillars
- Patent number 11,676,924
- Issue date Jun 13, 2023
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonded interconnect bridging
- Patent number 11,676,940
- Issue date Jun 13, 2023
- Advanced Micro Devices, Inc.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded chip package with anchor structures
- Patent number 11,367,628
- Issue date Jun 21, 2022
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with solder cap probe test pads
- Patent number 11,309,222
- Issue date Apr 19, 2022
- Advanced Micro Devices, Inc.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with reduced pitch conductive pillars
- Patent number 10,943,880
- Issue date Mar 9, 2021
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-RDL structure packages and methods of fabricating the same
- Patent number 10,903,168
- Issue date Jan 26, 2021
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-RDL structure packages and methods of fabricating the same
- Patent number 10,672,712
- Issue date Jun 2, 2020
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded chip combination
- Patent number 10,510,721
- Issue date Dec 17, 2019
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor chips packaging
- Patent number 9,449,907
- Issue date Sep 20, 2016
- Advanced Micro Devices, Inc.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor workpiece with backside metallization and methods of...
- Patent number 8,723,314
- Issue date May 13, 2014
- Advanced Micro Devices, Inc.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip device with underfill
- Patent number 8,691,626
- Issue date Apr 8, 2014
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having offset vias
- Patent number 8,624,404
- Issue date Jan 7, 2014
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with protective scribe structure
- Patent number 8,293,581
- Issue date Oct 23, 2012
- GLOBALFOUNDRIES Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connection structure with stress reduction arrangement f...
- Patent number 8,293,636
- Issue date Oct 23, 2012
- GLOBALFOUNDRIES, INC.
- Thomas Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having stress relief layers and methods for f...
- Patent number 7,977,160
- Issue date Jul 12, 2011
- GLOBALFOUNDRIES, INC.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with reinforcement structure
- Patent number 7,737,563
- Issue date Jun 15, 2010
- GLOBALFOUNDRIES Inc.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with crack stop
- Patent number 7,679,200
- Issue date Mar 16, 2010
- GLOBALFOUNDRIES Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID BONDED INTERCONNECT BRIDGING
- Publication number 20230387076
- Publication date Nov 30, 2023
- ADVANCED MICRO DEVICES, INC.
- LEI FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED CHIP PACKAGE WITH ANCHOR STRUCTURES
- Publication number 20220319871
- Publication date Oct 6, 2022
- ADVANCED MICRO DEVICES, INC.
- PRIYAL SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED INTERCONNECT BRIDGING
- Publication number 20220052023
- Publication date Feb 17, 2022
- ADVANCED MICRO DEVICES, INC.
- LEI FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUCED PITCH CONDUCTIVE PILLARS
- Publication number 20210193604
- Publication date Jun 24, 2021
- ADVANCED MICRO DEVICES, INC.
- PRIYAL SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH SOLDER CAP PROBE TEST PADS
- Publication number 20210066144
- Publication date Mar 4, 2021
- ADVANCED MICRO DEVICES, INC.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE WITH REINFORCING RIVETS
- Publication number 20210057352
- Publication date Feb 25, 2021
- ADVANCED MICRO DEVICES, INC.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED CHIP PACKAGE WITH ANCHOR STRUCTURES
- Publication number 20210020459
- Publication date Jan 21, 2021
- ADVANCED MICRO DEVICES, INC.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUCED PITCH CONDUCTIVE PILLARS
- Publication number 20200365543
- Publication date Nov 19, 2020
- ADVANCED MICRO DEVICES, INC.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-RDL STRUCTURE PACKAGES AND METHODS OF FABRICATING THE SAME
- Publication number 20200294923
- Publication date Sep 17, 2020
- ADVANCED MICRO DEVICES, INC.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-RDL STRUCTURE PACKAGES AND METHODS OF FABRICATING THE SAME
- Publication number 20200035606
- Publication date Jan 30, 2020
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY FAN-OUT PACKAGING
- Publication number 20190326257
- Publication date Oct 24, 2019
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED CHIP COMBINATION
- Publication number 20190051633
- Publication date Feb 14, 2019
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR CHIPS PACKAGING
- Publication number 20150279773
- Publication date Oct 1, 2015
- Advanced Micro Devices, Inc.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH EXPANSIVE UNDERBUMP METALLIZATION STRUCTURES
- Publication number 20130341785
- Publication date Dec 26, 2013
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING OFFSET VIAS
- Publication number 20130341802
- Publication date Dec 26, 2013
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WORKPIECE WITH BACKSIDE METALLIZATION AND METHODS OF...
- Publication number 20130221517
- Publication date Aug 29, 2013
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR CHIPS PACKAGING
- Publication number 20120193788
- Publication date Aug 2, 2012
- Advanced Micro Devices, Inc.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP DEVICE WITH UNDERFILL
- Publication number 20120061853
- Publication date Mar 15, 2012
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTION STRUCTURE WITH STRESS REDUCTION ARRANGEMENT F...
- Publication number 20120049343
- Publication date Mar 1, 2012
- Advanced Micro Devices, Inc.
- Thomas Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING STRESS RELIEF LAYERS AND METHODS FOR F...
- Publication number 20110031603
- Publication date Feb 10, 2011
- GLOBALFOUNDRIES INC.
- Michael SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip with Protective Scribe Structure
- Publication number 20100207250
- Publication date Aug 19, 2010
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip with Reinforcement Structure
- Publication number 20090302427
- Publication date Dec 10, 2009
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip with Crack Stop
- Publication number 20090065952
- Publication date Mar 12, 2009
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF SAWING SEMICONDUCTOR DEVICE
- Publication number 20080191318
- Publication date Aug 14, 2008
- Advanced Micro Devices, Inc.
- Michael Zhuoying Su
- B28 - WORKING CEMENT, CLAY, OR STONE

Person

Patents Grantslast 30 patents

Hybrid bonded interconnect bridging

Fan-out package with reinforcing rivets

Semiconductor chip with reduced pitch conductive pillars

Hybrid bonded interconnect bridging

Molded chip package with anchor structures

Semiconductor chip with solder cap probe test pads

Semiconductor chip with reduced pitch conductive pillars

Multi-RDL structure packages and methods of fabricating the same

Multi-RDL structure packages and methods of fabricating the same

Molded chip combination

Stacked semiconductor chips packaging

Semiconductor workpiece with backside metallization and methods of...

Semiconductor chip device with underfill

Integrated circuit package having offset vias

Semiconductor chip with protective scribe structure

Conductive connection structure with stress reduction arrangement f...

Semiconductor devices having stress relief layers and methods for f...

Semiconductor chip with reinforcement structure

Semiconductor chip with crack stop

Patents Applicationslast 30 patents

HYBRID BONDED INTERCONNECT BRIDGING

MOLDED CHIP PACKAGE WITH ANCHOR STRUCTURES

HYBRID BONDED INTERCONNECT BRIDGING

SEMICONDUCTOR CHIP WITH REDUCED PITCH CONDUCTIVE PILLARS

SEMICONDUCTOR CHIP WITH SOLDER CAP PROBE TEST PADS

FAN-OUT PACKAGE WITH REINFORCING RIVETS

MOLDED CHIP PACKAGE WITH ANCHOR STRUCTURES

SEMICONDUCTOR CHIP WITH REDUCED PITCH CONDUCTIVE PILLARS

MULTI-RDL STRUCTURE PACKAGES AND METHODS OF FABRICATING THE SAME

MULTI-RDL STRUCTURE PACKAGES AND METHODS OF FABRICATING THE SAME

HIGH DENSITY FAN-OUT PACKAGING

MOLDED CHIP COMBINATION

STACKED SEMICONDUCTOR CHIPS PACKAGING

SEMICONDUCTOR CHIP WITH EXPANSIVE UNDERBUMP METALLIZATION STRUCTURES

INTEGRATED CIRCUIT PACKAGE HAVING OFFSET VIAS

SEMICONDUCTOR WORKPIECE WITH BACKSIDE METALLIZATION AND METHODS OF...

STACKED SEMICONDUCTOR CHIPS PACKAGING

SEMICONDUCTOR CHIP DEVICE WITH UNDERFILL

CONDUCTIVE CONNECTION STRUCTURE WITH STRESS REDUCTION ARRANGEMENT F...

SEMICONDUCTOR DEVICES HAVING STRESS RELIEF LAYERS AND METHODS FOR F...

Semiconductor Chip with Protective Scribe Structure

Semiconductor Chip with Reinforcement Structure

Semiconductor Chip with Crack Stop

SEMICONDUCTOR DEVICE AND METHOD OF SAWING SEMICONDUCTOR DEVICE