Fu-Mauh Wong

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Penang, MY

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Patents Applicationslast 30 patents

Information Patent Application
Semiconductor package with encapsulant delamination-reducing struct...
- Publication number 20080122122
- Publication date May 29, 2008
- Weng Fei Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic package with improved thermal performance
- Publication number 20040120117
- Publication date Jun 24, 2004
- Cheng-Why Tan
- H01 - BASIC ELECTRIC ELEMENTS