Fu-Tai Liou

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Gradient barrier layer for copper back-end-of-line technology
- Patent number 7,067,917
- Issue date Jun 27, 2006
- United Microelectronics Corp.
- Fu-Tai Liou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method of an integrated chip
- Patent number 6,946,343
- Issue date Sep 20, 2005
- United Microelectronics Corp.
- Fu-Tai Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plug structure
- Patent number 6,320,254
- Issue date Nov 20, 2001
- United Microelectronics Corp.
- Fu-Tai Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating resistors in integrated circuits
- Patent number 6,211,030
- Issue date Apr 3, 2001
- United Microelectronics Corp.
- Fu-Tai Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a capacitor
- Patent number 6,171,899
- Issue date Jan 9, 2001
- United Microelectronics Corp.
- Fu-Tai Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating local interconnect
- Patent number 6,156,634
- Issue date Dec 5, 2000
- United Microelectronics Corp.
- Fu-Tai Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating load resistor
- Patent number 6,140,198
- Issue date Oct 31, 2000
- United Microelectronics Corp.
- Fu-Tai Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-free bonding pad structure
- Patent number 6,031,293
- Issue date Feb 29, 2000
- United Microelectronics Corporation
- Min-Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing embedded dynamic random access memory
- Patent number 6,017,790
- Issue date Jan 25, 2000
- United Microelectronics Corp.
- Fu-Tai Liou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF AN INTEGRATED CHIP
- Publication number 20040197985
- Publication date Oct 7, 2004
- Fu-Tai Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gradient barrier layer for copper back-end-of-line technology
- Publication number 20030186087
- Publication date Oct 2, 2003
- Fu-Tai Liou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Gradient barrier layer for copper back-end-of-line technology
- Publication number 20030186541
- Publication date Oct 2, 2003
- United Microelectronics Corp.
- Fu-Tai Liou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLUG STRUCTURE
- Publication number 20010045668
- Publication date Nov 29, 2001
- FU-TAI LIOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR ESD PROTECTION WITH SINGLE CRYSTAL SILICON SIDED JUNC...
- Publication number 20010038126
- Publication date Nov 8, 2001
- FU-TAI LIOU
- H01 - BASIC ELECTRIC ELEMENTS

Fu-Tai Liou

Person

Patents Grantslast 30 patents

Gradient barrier layer for copper back-end-of-line technology

Manufacturing method of an integrated chip

Plug structure

Method for fabricating resistors in integrated circuits

Method for fabricating a capacitor

Method of fabricating local interconnect

Method of fabricating load resistor

Package-free bonding pad structure

Method of manufacturing embedded dynamic random access memory

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF AN INTEGRATED CHIP

Gradient barrier layer for copper back-end-of-line technology

Gradient barrier layer for copper back-end-of-line technology

PLUG STRUCTURE

STRUCTURE FOR ESD PROTECTION WITH SINGLE CRYSTAL SILICON SIDED JUNC...