Fu-Tien Weng

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Microlens structure and fabrication method thereof
- Patent number 9,128,218
- Issue date Sep 8, 2015
- VisEra Technologies Company Limited
- Fu-Tien Weng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer level package and mask for fabricating the same
- Patent number 9,117,714
- Issue date Aug 25, 2015
- VisEra Technologies Company Limited
- Fu-Tien Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Color filter structure and method for fabricating the same
- Patent number 8,664,680
- Issue date Mar 4, 2014
- VisEra Technologies Company Limited
- Fu-Tien Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 8,129,762
- Issue date Mar 6, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu-Tien Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microlens structure for image sensors
- Patent number 7,704,778
- Issue date Apr 27, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chang Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor fabrication method and structure
- Patent number 7,507,598
- Issue date Mar 24, 2009
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fu-Tien Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microlens structure for improved CMOS image sensor sensitivity
- Patent number 7,505,206
- Issue date Mar 17, 2009
- Taiwan Semiconductor Manufacturing Company
- Jack Deng
- G02 - OPTICS
Information Patent Grant
Effective method to improve sub-micron color filter sensitivity
- Patent number 7,372,497
- Issue date May 13, 2008
- Taiwan Semiconductor Manufacturing Company
- Fu-Tien Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advance ridge structure for microlens gapless approach
- Patent number 7,264,976
- Issue date Sep 4, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jack Deng
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Material to improve image sensor yield during wafer sawing
- Patent number 7,071,032
- Issue date Jul 4, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor fabrication method and structure
- Patent number 6,964,916
- Issue date Nov 15, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin Chen Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Color filter with resist material in scribe lines
- Patent number 6,956,253
- Issue date Oct 18, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu-Tien Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating microlens with lithographic process
- Patent number 6,861,207
- Issue date Mar 1, 2005
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rework procedure for the microlens element of a CMOS image sensor
- Patent number 6,531,266
- Issue date Mar 11, 2003
- Taiwan Semiconductor Manufacturing Company
- Chih-Kung Chang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for fabricating high resolution color filter image array opt...
- Patent number 6,511,779
- Issue date Jan 28, 2003
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fu-Tien Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing nitride residue by changing the nitride film surface property
- Patent number 5,858,861
- Issue date Jan 12, 1999
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Tien Weng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COLOR FILTER STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20130180949
- Publication date Jul 18, 2013
- Fu-Tien Weng
- G02 - OPTICS
Information Patent Application
MICROLENS STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20130170047
- Publication date Jul 4, 2013
- Fu-Tien WENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Microlens Structure for Image Sensors
- Publication number 20100164040
- Publication date Jul 1, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chang Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20090104547
- Publication date Apr 23, 2009
- Taiwan Semiconductor Manufacturing Co., LTD
- Fu-Tien Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level package and mask for fabricating the same
- Publication number 20090102005
- Publication date Apr 23, 2009
- VisEra Technologies Company Limited
- Fu-Tien Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL MICROLENS STRUCTURE FOR CIS SENSITIVITY IMPROVEMENT
- Publication number 20080007839
- Publication date Jan 10, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jack DENG
- G02 - OPTICS
Information Patent Application
Advance ridge structure for microlens gapless approach
- Publication number 20060189062
- Publication date Aug 24, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jack Deng
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Microlens structure for image sensors
- Publication number 20060189024
- Publication date Aug 24, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chang Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced cavity structure for wafer level chip scale package
- Publication number 20060131710
- Publication date Jun 22, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin Chen Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor fabrication method and structure
- Publication number 20060019424
- Publication date Jan 26, 2006
- Fu-Tien Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Effective method to improve sub-micron color filter sensitivity
- Publication number 20050242271
- Publication date Nov 3, 2005
- Taiwan Semiconductor Manufacturing Co.
- Fu-Tien Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING MICROLENS WITH LITHOGRAPHIC PROCESS
- Publication number 20040265752
- Publication date Dec 30, 2004
- Hung-Jen Hsu
- G02 - OPTICS
Information Patent Application
Method to reduce excess color filter signal deviation
- Publication number 20040248383
- Publication date Dec 9, 2004
- Fu-Tien Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor fabrication method and structure
- Publication number 20040248384
- Publication date Dec 9, 2004
- Chin Chen Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optoelectronic microelectronic fabrication with infrared filter and...
- Publication number 20020063214
- Publication date May 30, 2002
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Yu-Kung Hsiao
- G01 - MEASURING TESTING

Fu-Tien Weng

Person

Patents Grantslast 30 patents

Microlens structure and fabrication method thereof

Wafer level package and mask for fabricating the same

Color filter structure and method for fabricating the same

Image sensor

Microlens structure for image sensors

Image sensor fabrication method and structure

Microlens structure for improved CMOS image sensor sensitivity

Effective method to improve sub-micron color filter sensitivity

Advance ridge structure for microlens gapless approach

Material to improve image sensor yield during wafer sawing

Image sensor fabrication method and structure

Color filter with resist material in scribe lines

Method for fabricating microlens with lithographic process

Rework procedure for the microlens element of a CMOS image sensor

Method for fabricating high resolution color filter image array opt...

Reducing nitride residue by changing the nitride film surface property

Patents Applicationslast 30 patents

COLOR FILTER STRUCTURE AND METHOD FOR FABRICATING THE SAME

MICROLENS STRUCTURE AND FABRICATION METHOD THEREOF

Microlens Structure for Image Sensors

IMAGE SENSOR

Wafer level package and mask for fabricating the same

NOVEL MICROLENS STRUCTURE FOR CIS SENSITIVITY IMPROVEMENT

Advance ridge structure for microlens gapless approach

Microlens structure for image sensors

Advanced cavity structure for wafer level chip scale package

Image sensor fabrication method and structure

Effective method to improve sub-micron color filter sensitivity

METHOD FOR FABRICATING MICROLENS WITH LITHOGRAPHIC PROCESS

Method to reduce excess color filter signal deviation

Image sensor fabrication method and structure

Optoelectronic microelectronic fabrication with infrared filter and...