Fu Yung Huang

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Hsinchu Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Memory module structure
- Patent number 6,642,554
- Issue date Nov 4, 2003
- Kingpak Technology, Inc.
- Nai Hua Yeh
- G11 - INFORMATION STORAGE
Information Patent Grant
Package structure for a photosensitive chip
- Patent number 6,590,269
- Issue date Jul 8, 2003
- Kingpak Technology Inc.
- Jason Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Image sensor structure
- Publication number 20030116817
- Publication date Jun 26, 2003
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory module structure
- Publication number 20030094628
- Publication date May 22, 2003
- Nai Hua Yeh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Structure of stacked integrated circuits and method for manufacturi...
- Publication number 20020096762
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure of an integrated circuit
- Publication number 20020096747
- Publication date Jul 25, 2002
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF STACKED INTEGRATED CIRCUITS AND METHOD FOR MANUFACTURI...
- Publication number 20020096761
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS