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Patents Grantslast 30 patents

Information Patent Grant
Thin semiconductor package for notched semiconductor die
- Patent number 11,942,369
- Issue date Mar 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor package and related methods
- Patent number 10,763,173
- Issue date Sep 1, 2020
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor package and related methods
- Patent number 10,319,639
- Issue date Jun 11, 2019
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20200357697
- Publication date Nov 12, 2020
- Semiconductor Components Industries, LLC
- Shutesh KRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190252255
- Publication date Aug 15, 2019
- Semiconductor Components Industries, LLC
- Shutesh KRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190057900
- Publication date Feb 21, 2019
- Semiconductor Components Industries, LLC
- Shutesh KRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS