Fui Yee Lim

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Kuala Lumpur, MY

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Patents Grantslast 30 patents

Information Patent Grant
Circuit modules with front-side interposer terminals and through-mo...
- Patent number 11,581,241
- Issue date Feb 14, 2023
- NXP USA, INC.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW-STRESS THERMAL INTERFACE
- Publication number 20240213114
- Publication date Jun 27, 2024
- NXP USA, Inc.
- Sharan Kishore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULES WITH FRONT-SIDE INTERPOSER TERMINALS AND THROUGH-MO...
- Publication number 20220208646
- Publication date Jun 30, 2022
- NXP USA, Inc.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS