TREA

Fukashi TANAKA

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Die bonder and bonding method
    • Patent number 9,530,751
    • Issue date Dec 27, 2016
    • FASFORD TECHNOLOGY CO., LTD.
    • Kazuo Nakano
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Die Bonder and Bonding Method
    • Publication number 20160099225
    • Publication date Apr 7, 2016
    • Fasford Technology Co., Ltd.
    • Kazuo NAKANO
    • H01 - BASIC ELECTRIC ELEMENTS