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Fukashi Tanaka
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Kumagaya, JP
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Patents Grants
last 30 patents
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Patent Grant
Die bonder and bonding method
Patent number
8,727,202
Issue date
May 20, 2014
Hitachi High-Tech Instruments Co., Ltd.
Nobuhisa Nakajima
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
Die Bonder and Bonding Method
Publication number
20130071956
Publication date
Mar 21, 2013
Hitachi High-Tech Instruments Co., Ltd.
Nobuhisa NAKAJIMA
H01 - BASIC ELECTRIC ELEMENTS