TREA

Fukashi Tanaka

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  • Kumagaya, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Die bonder and bonding method
    • Patent number 8,727,202
    • Issue date May 20, 2014
    • Hitachi High-Tech Instruments Co., Ltd.
    • Nobuhisa Nakajima
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Die Bonder and Bonding Method
    • Publication number 20130071956
    • Publication date Mar 21, 2013
    • Hitachi High-Tech Instruments Co., Ltd.
    • Nobuhisa NAKAJIMA
    • H01 - BASIC ELECTRIC ELEMENTS