Fumiaki Akase

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Ibaraki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Carrier-attached copper foil and printed board using the copper foil
- Patent number 6,960,391
- Issue date Nov 1, 2005
- Nikko Materials Co., Ltd.
- Takashi Natsume
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Copper Foil for Semiconductor Package Substrate and Substrate for S...
- Publication number 20120107637
- Publication date May 3, 2012
- JX NIPPON MINING & METALS CORPORATION
- Fumiaki Akase
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Foil for Printed Wiring Board
- Publication number 20090208762
- Publication date Aug 20, 2009
- Nippon Mining & Metals Co., Ltd.
- Fumiaki Akase
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Carrier-attached copper foil and printed board using the copper foil
- Publication number 20040048047
- Publication date Mar 11, 2004
- Takashi Natsume
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR