Fumiaki TOYAMA

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional memory array with dual-level peripheral circuits...
- Patent number 12,004,348
- Issue date Jun 4, 2024
- SanDisk Technologies LLC
- Yuki Mizutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory with efficient signal routing
- Patent number 11,973,044
- Issue date Apr 30, 2024
- SANDISK TECHNOLOGIES LLC
- Shiqian Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory with three dimensional stacked word line switches
- Patent number 11,943,922
- Issue date Mar 26, 2024
- Western Digital Technologies, Inc.
- Guangyuan Li
Information Patent Grant
Non-volatile memory with efficient word line hook-up
- Patent number 11,894,056
- Issue date Feb 6, 2024
- SanDisk Technologies LLC
- Shiqian Shao
- G11 - INFORMATION STORAGE
Information Patent Grant
Non-volatile memory with different word line hook up regions based...
- Patent number 11,817,150
- Issue date Nov 14, 2023
- SanDisk Technologies LLC
- Shiqian Shao
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device having support-die-assisted source...
- Patent number 11,791,327
- Issue date Oct 17, 2023
- SanDisk Technologies LLC
- Kwang-Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with separated contact regions and...
- Patent number 11,792,988
- Issue date Oct 17, 2023
- SanDisk Technologies LLC
- Hiroyuki Ogawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Bonded assembly of a memory die and a logic die including laterally...
- Patent number 11,758,730
- Issue date Sep 12, 2023
- SanDisk Technologies LLC
- Fumiaki Toyama
- G11 - INFORMATION STORAGE
Information Patent Grant
Capacitor structure including bonding pads as electrodes and method...
- Patent number 11,728,305
- Issue date Aug 15, 2023
- SanDisk Technologies LLC
- Shiqian Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory with different use of metal lines in word line...
- Patent number 11,424,207
- Issue date Aug 23, 2022
- SanDisk Technologies LLC
- Shiqian Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory with multiple wells for word line switch transi...
- Patent number 11,404,123
- Issue date Aug 2, 2022
- SanDisk Technologies LLC
- Shiqian Shao
- G11 - INFORMATION STORAGE
Information Patent Grant
Bonded assembly of semiconductor dies containing pad level across-d...
- Patent number 11,342,244
- Issue date May 24, 2022
- SanDisk Technologies LLC
- Jee-Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing multiple size drain cont...
- Patent number 11,251,191
- Issue date Feb 15, 2022
- SanDisk Technologies LLC
- Lishan Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly with vertical power and control signal connection a...
- Patent number 11,211,370
- Issue date Dec 28, 2021
- SanDisk Technologies LLC
- Jee-Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing horizontal and vertical...
- Patent number 11,139,237
- Issue date Oct 5, 2021
- SanDisk Technologies LLC
- Shiqian Shao
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device having support-die-assisted source...
- Patent number 11,133,297
- Issue date Sep 28, 2021
- SanDisk Technologies LLC
- Kwang-Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing width-modulated connecti...
- Patent number 11,114,459
- Issue date Sep 7, 2021
- SanDisk Technologies LLC
- Takaaki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-tier three-dimensional memory device containing dielectric we...
- Patent number 11,081,443
- Issue date Aug 3, 2021
- SanDisk Technologies LLC
- Yuki Mizutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including contact-level bit-line-co...
- Patent number 11,011,209
- Issue date May 18, 2021
- SanDisk Technologies LLC
- Jee-Yeon Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Word line decoder circuitry under a three-dimensional memory array
- Patent number 10,991,429
- Issue date Apr 27, 2021
- SanDisk Technologies LLC
- Hiroyuki Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including signal and power connecti...
- Patent number 10,872,899
- Issue date Dec 22, 2020
- SanDisk Technologies LLC
- Jee-Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including signal and power connecti...
- Patent number 10,861,873
- Issue date Dec 8, 2020
- SanDisk Technologies LLC
- Jee-Yeon Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Through-array conductive via structures for a three-dimensional mem...
- Patent number 10,840,260
- Issue date Nov 17, 2020
- SanDisk Technologies LLC
- James Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increased terrace configuration for non-volatile memory
- Patent number 10,726,921
- Issue date Jul 28, 2020
- SanDisk Technologies LLC
- Chia-Lin Hsiung
- G11 - INFORMATION STORAGE
Information Patent Grant
Word line decoder circuitry under a three-dimensional memory array
- Patent number 10,720,213
- Issue date Jul 21, 2020
- SanDisk Technologies LLC
- Hiroyuki Ogawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory die having wafer warpage reduction through stress balancing...
- Patent number 10,658,381
- Issue date May 19, 2020
- SanDisk Technologies LLC
- Jixin Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device containing dummy antenna diodes
- Patent number 10,580,787
- Issue date Mar 3, 2020
- SanDisk Technologies LLC
- Masatoshi Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having support-die-assisted source...
- Patent number 10,510,738
- Issue date Dec 17, 2019
- SanDisk Technologies LLC
- Kwang-Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-memory-level via structures for a three-dimensional memory...
- Patent number 10,381,371
- Issue date Aug 13, 2019
- SanDisk Technologies LLC
- Hiroyuki Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal contact via structure surrounded by an air gap and method of...
- Patent number 10,319,680
- Issue date Jun 11, 2019
- SanDisk Technologies LLC
- Jongsun Sel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHODS FOR BONDING PAD REDISTRIBUTION LAYERS IN INTE...
- Publication number 20240096826
- Publication date Mar 21, 2024
- SANDISK TECHNOLOGIES LLC
- Guangyuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY ARRAY WITH DUAL-LEVEL PERIPHERAL CIRCUITS...
- Publication number 20240032299
- Publication date Jan 25, 2024
- SANDISK TECHNOLOGIES LLC
- Masanori TSUTSUMI
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH HIGH CONTACT VIA DENSITY AND M...
- Publication number 20240006310
- Publication date Jan 4, 2024
- SANDISK TECHNOLOGIES LLC
- Tomohiro KUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH HIGH CONTACT VIA DENSITY AND M...
- Publication number 20240005990
- Publication date Jan 4, 2024
- SANDISK TECHNOLOGIES LLC
- Hirofumi TOKITA
- G11 - INFORMATION STORAGE
Information Patent Application
NON-VOLATILE MEMORY WITH INTER-DIE CONNECTION
- Publication number 20230386576
- Publication date Nov 30, 2023
- SANDISK TECHNOLOGIES LLC
- Shiqian Shao
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A METAL OXIDE ETCH STOP L...
- Publication number 20230389317
- Publication date Nov 30, 2023
- Western Digital Technologies, Inc.
- Mitsuhiro Togo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY WITH EFFICIENT WORD LINE HOOK-UP
- Publication number 20230268001
- Publication date Aug 24, 2023
- SANDISK TECHNOLOGIES LLC
- Shiqian Shao
- G11 - INFORMATION STORAGE
Information Patent Application
NON-VOLATILE MEMORY WITH EFFICIENT SIGNAL ROUTING
- Publication number 20230207504
- Publication date Jun 29, 2023
- SANDISK TECHNOLOGIES LLC
- Shiqian Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED CONTACT REGIONS AND...
- Publication number 20230045001
- Publication date Feb 9, 2023
- SANDISK TECHNOLOGIES LLC
- Hiroyuki Ogawa
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY ARRAY WITH DUAL-LEVEL PERIPHERAL CIRCUITS...
- Publication number 20220399362
- Publication date Dec 15, 2022
- SANDISK TECHNOLOGIES LLC
- Yuki MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY ARRAY WITH DUAL-LEVEL PERIPHERAL CIRCUITS...
- Publication number 20220399358
- Publication date Dec 15, 2022
- SANDISK TECHNOLOGIES LLC
- Yuki MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE INCLUDING BONDING PADS AS ELECTRODES AND METHOD...
- Publication number 20220367393
- Publication date Nov 17, 2022
- SANDISK TECHNOLOGIES LLC
- Shiqian SHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY OF A MEMORY DIE AND A LOGIC DIE INCLUDING LATERALLY...
- Publication number 20220359555
- Publication date Nov 10, 2022
- SANDISK TECHNOLOGIES LLC
- Fumiaki TOYAMA
- G11 - INFORMATION STORAGE
Information Patent Application
NON-VOLATILE MEMORY WITH DIFFERENT WORD LINE HOOK UP REGIONS BASED...
- Publication number 20220319603
- Publication date Oct 6, 2022
- SANDISK TECHNOLOGIES LLC
- Shiqian Shao
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING SUPPORT-DIE-ASSISTED SOURCE...
- Publication number 20220013518
- Publication date Jan 13, 2022
- SANDISK TECHNOLOGIES LLC
- Kwang-Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY WITH VERTICAL POWER AND CONTROL SIGNAL CONNECTION A...
- Publication number 20210233900
- Publication date Jul 29, 2021
- SANDISK TECHNOLOGIES LLC
- Jee-Yeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY OF SEMICONDUCTOR DIES CONTAINING PAD LEVEL ACROSS-D...
- Publication number 20210225736
- Publication date Jul 22, 2021
- SANDISK TECHNOLOGIES LLC
- Jee-Yeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING WIDTH-MODULATED CONNECTI...
- Publication number 20210134827
- Publication date May 6, 2021
- SANDISK TECHNOLOGIES LLC
- Takaaki IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CONTACT-LEVEL BIT-LINE-CO...
- Publication number 20210098029
- Publication date Apr 1, 2021
- SANDISK TECHNOLOGIES LLC
- Jee-Yeon KIM
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING HORIZONTAL AND VERTICAL...
- Publication number 20210057336
- Publication date Feb 25, 2021
- SANDISK TECHNOLOGIES LLC
- Shiqian SHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING SIGNAL AND POWER CONNECTI...
- Publication number 20200357814
- Publication date Nov 12, 2020
- SANDISK TECHNOLOGIES LLC
- Jee-Yeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING SIGNAL AND POWER CONNECTI...
- Publication number 20200357811
- Publication date Nov 12, 2020
- SANDISK TECHNOLOGIES LLC
- Jee-Yeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORD LINE DECODER CIRCUITRY UNDER A THREE-DIMENSIONAL MEMORY ARRAY
- Publication number 20200294599
- Publication date Sep 17, 2020
- SANDISK TECHNOLOGIES LLC
- Hiroyuki OGAWA
- G11 - INFORMATION STORAGE
Information Patent Application
THROUGH-ARRAY CONDUCTIVE VIA STRUCTURES FOR A THREE-DIMENSIONAL MEM...
- Publication number 20200235120
- Publication date Jul 23, 2020
- SANDISK TECHNOLOGIES LLC
- James KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTIPLE SIZE DRAIN CONT...
- Publication number 20200203365
- Publication date Jun 25, 2020
- SANDISK TECHNOLOGIES LLC
- Lishan WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING SUPPORT-DIE-ASSISTED SOURCE...
- Publication number 20200066703
- Publication date Feb 27, 2020
- SANDISK TECHNOLOGIES LLC
- Kwang-Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ANTENNA DIODES AND METHO...
- Publication number 20190371800
- Publication date Dec 5, 2019
- SANDISK TECHNOLOGIES LLC
- Masatoshi NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING SUPPORT-DIE-ASSISTED SOURCE...
- Publication number 20190221557
- Publication date Jul 18, 2019
- SANDISK TECHNOLOGIES LLC
- Kwang-Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASED TERRACE CONFIGURATION FOR NON-VOLATILE MEMORY
- Publication number 20190088335
- Publication date Mar 21, 2019
- SanDisk Technologies LLC
- Chia-Lin Hsiung
- G11 - INFORMATION STORAGE
Information Patent Application
Word Line Decoder Circuitry under a Three-Dimensional Memory Array
- Publication number 20190057741
- Publication date Feb 21, 2019
- SanDisk Technologies LLC
- Hiroyuki OGAWA
- G11 - INFORMATION STORAGE

Fumiaki TOYAMA

Person

Patents Grantslast 30 patents

Three-dimensional memory array with dual-level peripheral circuits...

Non-volatile memory with efficient signal routing

Non-volatile memory with three dimensional stacked word line switches

Non-volatile memory with efficient word line hook-up

Non-volatile memory with different word line hook up regions based...

Three-dimensional memory device having support-die-assisted source...

Three-dimensional memory device with separated contact regions and...

Bonded assembly of a memory die and a logic die including laterally...

Capacitor structure including bonding pads as electrodes and method...

Non-volatile memory with different use of metal lines in word line...

Non-volatile memory with multiple wells for word line switch transi...

Bonded assembly of semiconductor dies containing pad level across-d...

Three-dimensional memory device containing multiple size drain cont...

Bonded assembly with vertical power and control signal connection a...

Three-dimensional memory device containing horizontal and vertical...

Three-dimensional memory device having support-die-assisted source...

Three-dimensional memory device containing width-modulated connecti...

Multi-tier three-dimensional memory device containing dielectric we...

Three-dimensional memory device including contact-level bit-line-co...

Word line decoder circuitry under a three-dimensional memory array

Three-dimensional memory device including signal and power connecti...

Three-dimensional memory device including signal and power connecti...

Through-array conductive via structures for a three-dimensional mem...

Increased terrace configuration for non-volatile memory

Word line decoder circuitry under a three-dimensional memory array

Memory die having wafer warpage reduction through stress balancing...

Three-dimensional memory device containing dummy antenna diodes

Three-dimensional memory device having support-die-assisted source...

Through-memory-level via structures for a three-dimensional memory...

Metal contact via structure surrounded by an air gap and method of...

Patents Applicationslast 30 patents

APPARATUS AND METHODS FOR BONDING PAD REDISTRIBUTION LAYERS IN INTE...

THREE-DIMENSIONAL MEMORY ARRAY WITH DUAL-LEVEL PERIPHERAL CIRCUITS...

THREE-DIMENSIONAL MEMORY DEVICE WITH HIGH CONTACT VIA DENSITY AND M...

THREE-DIMENSIONAL MEMORY DEVICE WITH HIGH CONTACT VIA DENSITY AND M...

NON-VOLATILE MEMORY WITH INTER-DIE CONNECTION

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A METAL OXIDE ETCH STOP L...

NON-VOLATILE MEMORY WITH EFFICIENT WORD LINE HOOK-UP

NON-VOLATILE MEMORY WITH EFFICIENT SIGNAL ROUTING

THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED CONTACT REGIONS AND...

THREE-DIMENSIONAL MEMORY ARRAY WITH DUAL-LEVEL PERIPHERAL CIRCUITS...

THREE-DIMENSIONAL MEMORY ARRAY WITH DUAL-LEVEL PERIPHERAL CIRCUITS...

CAPACITOR STRUCTURE INCLUDING BONDING PADS AS ELECTRODES AND METHOD...

BONDED ASSEMBLY OF A MEMORY DIE AND A LOGIC DIE INCLUDING LATERALLY...

NON-VOLATILE MEMORY WITH DIFFERENT WORD LINE HOOK UP REGIONS BASED...

THREE-DIMENSIONAL MEMORY DEVICE HAVING SUPPORT-DIE-ASSISTED SOURCE...

BONDED ASSEMBLY WITH VERTICAL POWER AND CONTROL SIGNAL CONNECTION A...

BONDED ASSEMBLY OF SEMICONDUCTOR DIES CONTAINING PAD LEVEL ACROSS-D...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING WIDTH-MODULATED CONNECTI...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CONTACT-LEVEL BIT-LINE-CO...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING HORIZONTAL AND VERTICAL...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING SIGNAL AND POWER CONNECTI...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING SIGNAL AND POWER CONNECTI...

WORD LINE DECODER CIRCUITRY UNDER A THREE-DIMENSIONAL MEMORY ARRAY

THROUGH-ARRAY CONDUCTIVE VIA STRUCTURES FOR A THREE-DIMENSIONAL MEM...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTIPLE SIZE DRAIN CONT...

THREE-DIMENSIONAL MEMORY DEVICE HAVING SUPPORT-DIE-ASSISTED SOURCE...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ANTENNA DIODES AND METHO...

THREE-DIMENSIONAL MEMORY DEVICE HAVING SUPPORT-DIE-ASSISTED SOURCE...

INCREASED TERRACE CONFIGURATION FOR NON-VOLATILE MEMORY

Word Line Decoder Circuitry under a Three-Dimensional Memory Array