Fumihiko Kawai

Person

Kyoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Magnetic gasket and cooling apparatus
- Patent number 11,085,692
- Issue date Aug 10, 2021
- Panasonic Corporation
- Toru Okazaki
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Resin encapsulated semiconductor device and method for manufacturin...
- Patent number 8,193,091
- Issue date Jun 5, 2012
- Panasonic Corporation
- Fumihiko Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe, resin-molded semiconductor device including the leadfram...
- Patent number 6,984,880
- Issue date Jan 10, 2006
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe, resin-molded semiconductor device including the leadfram...
- Patent number 6,720,207
- Issue date Apr 13, 2004
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device and method for manufacturin...
- Patent number 6,710,430
- Issue date Mar 23, 2004
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with multiple rows of external terminals
- Patent number 6,674,154
- Issue date Jan 6, 2004
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a resin-sealed semiconductor device
- Patent number 6,642,082
- Issue date Nov 4, 2003
- Matsushita Electric Industrial Co., Ltd.
- Yukio Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MAGNETIC GASKET AND COOLING APPARATUS
- Publication number 20200003481
- Publication date Jan 2, 2020
- PANASONIC CORPORATION
- Toru OKAZAKI
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Application
Leadframe, resin-molded semiconductor device including the leadfram...
- Publication number 20040094829
- Publication date May 20, 2004
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame, method for manufacturing the same, resin-encapsulated s...
- Publication number 20030127711
- Publication date Jul 10, 2003
- Matsushita Electric Industrial Co., Ltd.
- Fumihiko Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a resin-sealed semiconductor device
- Publication number 20030003627
- Publication date Jan 2, 2003
- Yukio Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame
- Publication number 20020121670
- Publication date Sep 5, 2002
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-encapsulated semiconductor device and method for manufacturin...
- Publication number 20020121650
- Publication date Sep 5, 2002
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe, resin-molded semiconductor device including the leadfram...
- Publication number 20020109214
- Publication date Aug 15, 2002
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS

Fumihiko Kawai

Person

Patents Grantslast 30 patents

Magnetic gasket and cooling apparatus

Resin encapsulated semiconductor device and method for manufacturin...

Leadframe, resin-molded semiconductor device including the leadfram...

Leadframe, resin-molded semiconductor device including the leadfram...

Resin-encapsulated semiconductor device and method for manufacturin...

Lead frame with multiple rows of external terminals

Method for manufacturing a resin-sealed semiconductor device

Patents Applicationslast 30 patents

MAGNETIC GASKET AND COOLING APPARATUS

Leadframe, resin-molded semiconductor device including the leadfram...

Lead frame, method for manufacturing the same, resin-encapsulated s...

Method for manufacturing a resin-sealed semiconductor device

Lead frame

Resin-encapsulated semiconductor device and method for manufacturin...

Leadframe, resin-molded semiconductor device including the leadfram...