Fumihiko MOMOSE

Person

Higashichikuma Gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module and method for manufacturing same
- Patent number 11,749,581
- Issue date Sep 5, 2023
- Fuji Electric Co., Ltd.
- Yuhei Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material for semiconductor device
- Patent number 11,145,615
- Issue date Oct 12, 2021
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 10,896,892
- Issue date Jan 19, 2021
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material for semiconductor device
- Patent number 10,727,194
- Issue date Jul 28, 2020
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,497,586
- Issue date Dec 3, 2019
- Fuji Electric Co., Ltd.
- Yuta Tamai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,297,527
- Issue date May 21, 2019
- Fuji Electric Co., Ltd.
- Takashi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,276,474
- Issue date Apr 30, 2019
- Fuji Electric Co., Ltd.
- Takashi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 10,199,305
- Issue date Feb 5, 2019
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 10,157,877
- Issue date Dec 18, 2018
- Fuji Electric Co., Ltd.
- Kazumasa Kido
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor device with heat dissipation and method of making same
- Patent number 10,090,222
- Issue date Oct 2, 2018
- Fuji Electric Co., Ltd.
- Akira Hirao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 10,090,223
- Issue date Oct 2, 2018
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,978,701
- Issue date May 22, 2018
- Fuji Electric Co., Ltd.
- Takashi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 9,748,186
- Issue date Aug 29, 2017
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,860,220
- Issue date Oct 14, 2014
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,395,262
- Issue date Mar 12, 2013
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230307346
- Publication date Sep 28, 2023
- Fuji Electric Co., Ltd.
- Yasuaki HOZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220375845
- Publication date Nov 24, 2022
- Fuji Electric Co., Ltd.
- Norihiro DAICHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
- Publication number 20210407953
- Publication date Dec 30, 2021
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20200388553
- Publication date Dec 10, 2020
- FUJI ELECTRIC CO., LTD.
- Yuhei NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
- Publication number 20200303337
- Publication date Sep 24, 2020
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION AND METHOD OF MAKING SAME
- Publication number 20180240730
- Publication date Aug 23, 2018
- Fuji Electric Co., Ltd.
- Akira HIRAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180190570
- Publication date Jul 5, 2018
- Fuji Electric Co., Ltd.
- Fumihiko MOMOSE
- C21 - METALLURGY OF IRON
Information Patent Application
SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
- Publication number 20180033761
- Publication date Feb 1, 2018
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20170372977
- Publication date Dec 28, 2017
- Fuji Electric Co., Ltd.
- Yuta TAMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20170317008
- Publication date Nov 2, 2017
- Fuji Electric Co., Ltd.
- Fumihiko MOMOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170077009
- Publication date Mar 16, 2017
- Fuji Electric Co., Ltd.
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160225688
- Publication date Aug 4, 2016
- Fuji Electric Co., Ltd.
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20160035690
- Publication date Feb 4, 2016
- Fuji Electric Co., Ltd.
- Kazumasa KIDO
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160035683
- Publication date Feb 4, 2016
- Fuji Electric Co., Ltd.
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20150380368
- Publication date Dec 31, 2015
- Fuji Electric Co., Ltd.
- Fumihiko MOMOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150303166
- Publication date Oct 22, 2015
- Fuji Electric Co., Ltd.
- Fumihiko MOMOSE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130244380
- Publication date Sep 19, 2013
- Fuji Electric Co., Ltd.
- Fumihiko MOMOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110186999
- Publication date Aug 4, 2011
- Fuji Electric Systems Co., Ltd.
- Fumihiko Momose
- H01 - BASIC ELECTRIC ELEMENTS

Fumihiko MOMOSE

Person

Patents Grantslast 30 patents

Semiconductor module and method for manufacturing same

Solder material for semiconductor device

Wire bonding apparatus

Solder material for semiconductor device

Semiconductor device and a method of manufacturing the same

Semiconductor device

Semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device with heat dissipation and method of making same

Semiconductor device and method of manufacturing same

Semiconductor device

Semiconductor device and method for manufacturing the semiconductor...

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME

SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION AND METHOD OF MAKING SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME