Fumihiko Ooka

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with double-sided electrode structure and its...
- Patent number 7,884,466
- Issue date Feb 8, 2011
- Oki Electric Industry Co., Ltd.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for an acceleration sensor
- Patent number 7,571,647
- Issue date Aug 11, 2009
- Oki Semiconductor Co., Ltd.
- Kengo Takemasa
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device
- Patent number 7,569,917
- Issue date Aug 4, 2009
- Oki Semiconductor Co., Ltd.
- Masahiko Sugihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package and fabrication method thereof
- Patent number 7,489,043
- Issue date Feb 10, 2009
- Oki Electric Industry Co., Ltd.
- Akira Tokumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating a semiconductor chip package
- Patent number 7,410,829
- Issue date Aug 12, 2008
- Oki Electric Industry Co., Ltd.
- Akira Tokumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor chip package
- Patent number 7,304,395
- Issue date Dec 4, 2007
- Oki Electric Industry Co., Ltd.
- Akira Tokumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming a ball grid array package
- Patent number 6,975,039
- Issue date Dec 13, 2005
- Oki Electric Industry Co., Ltd.
- Kiyoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a ball grid array package
- Patent number 6,677,219
- Issue date Jan 13, 2004
- Oki Electric Industry Co., Ltd.
- Kiyoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 6,300,685
- Issue date Oct 9, 2001
- Oki Electric Industry Co., Ltd.
- Kiyoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH DOUBLE-SIDED ELECTRODE STRUCTURE AND ITS...
- Publication number 20110089551
- Publication date Apr 21, 2011
- Oki Electric Industry Co., Ltd.
- Masamichi ISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DOUBLE-SIDED ELECTRODE STRUCTURE AND ITS...
- Publication number 20090072381
- Publication date Mar 19, 2009
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabrication of a semiconductor chip package
- Publication number 20080014680
- Publication date Jan 17, 2008
- Oki Electric Industry Co., Ltd.
- Akira Tokumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device
- Publication number 20070284707
- Publication date Dec 13, 2007
- Oki Electric Industry Co., Ltd.
- Masahiko Sugihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package and fabrication method thereof
- Publication number 20070090540
- Publication date Apr 26, 2007
- Oki Electric Industry Co., Ltd.
- Akira Tokumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Package structure for an acceleration sensor
- Publication number 20070044557
- Publication date Mar 1, 2007
- Kengo Takemasa
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor chip package and fabrication method thereof
- Publication number 20070018314
- Publication date Jan 25, 2007
- Akira Tokumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor package
- Publication number 20040094833
- Publication date May 20, 2004
- Kiyoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20010042924
- Publication date Nov 22, 2001
- Kiyoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS

Fumihiko Ooka

Person

Patents Grantslast 30 patents

Semiconductor device with double-sided electrode structure and its...

Package structure for an acceleration sensor

Semiconductor device

Semiconductor chip package and fabrication method thereof

Method of fabricating a semiconductor chip package

Semiconductor chip package

Method of forming a ball grid array package

Method of forming a ball grid array package

Semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH DOUBLE-SIDED ELECTRODE STRUCTURE AND ITS...

SEMICONDUCTOR DEVICE WITH DOUBLE-SIDED ELECTRODE STRUCTURE AND ITS...

Method of fabrication of a semiconductor chip package

Semiconductor device

Semiconductor chip package and fabrication method thereof

Package structure for an acceleration sensor

Semiconductor chip package and fabrication method thereof

Semiconductor package

Semiconductor package