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Fumihiro Imai
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Iruma-shi, JP
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Patents Grants
last 30 patents
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Patent Grant
Lead-free solder paste
Patent number
9,770,786
Issue date
Sep 26, 2017
Senju Metal Industry Co., Ltd.
Yoshitaka Toyoda
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
LEAD-FREE SOLDER PASTE
Publication number
20130098506
Publication date
Apr 25, 2013
Yoshitaka Toyoda
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...