Fumihisa MIYASAKA

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Nagano, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate and method of making wiring substrate
- Patent number 9,560,768
- Issue date Jan 31, 2017
- Shinko Electric Industries Co., Ltd.
- Yasuhiko Kusama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method of making wiring substrate
- Patent number 9,497,863
- Issue date Nov 15, 2016
- Shinko Electric Industries Co., Ltd.
- Yasuhiko Kusama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and semiconductor package
- Patent number 8,587,104
- Issue date Nov 19, 2013
- Shinko Electric Industries Co., Ltd.
- Fumihisa Miyasaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE AND METHOD OF MAKING WIRING SUBSTRATE
- Publication number 20150257275
- Publication date Sep 10, 2015
- Shinko Electric Industries Co., Ltd.
- Yasuhiko KUSAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MAKING WIRING SUBSTRATE
- Publication number 20150257274
- Publication date Sep 10, 2015
- Shinko Electric Industries Co., Ltd.
- Yasuhiko KUSAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20120161311
- Publication date Jun 28, 2012
- Shinko Electric Industries Co., Ltd.
- Fumihisa MIYASAKA
- H01 - BASIC ELECTRIC ELEMENTS