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Fuminori ARAI

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Patents Grantslast 30 patents

  • Information Patent Grant

    Curing agent composition for curing 2-methylene-1,3-dicarbonyl comp...
    • Patent number 12,146,014
    • Issue date Nov 19, 2024
    • Namics Corporation
    • Fuminori Arai
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Resin composition
    • Patent number 11,773,301
    • Issue date Oct 3, 2023
    • Namics Corporation
    • Ayako Sato
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Resin composition
    • Patent number 11,634,615
    • Issue date Apr 25, 2023
    • Namics Corporation
    • Fuminori Arai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Resin composition, adhesive, sealing material, dam agent, semicondu...
    • Patent number 11,472,957
    • Issue date Oct 18, 2022
    • Namics Corporation
    • Kazuki Iwaya
    • B32 - LAYERED PRODUCTS
  • Information Patent Grant

    Resin composition
    • Patent number 11,230,617
    • Issue date Jan 25, 2022
    • Namics Corporation
    • Fuminori Arai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device and image sensor module
    • Patent number 10,472,461
    • Issue date Nov 12, 2019
    • Namics Corporation
    • Fuminori Arai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Resin composition
    • Patent number 10,246,550
    • Issue date Apr 2, 2019
    • Namics Corporation
    • Kazuki Iwaya
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Resin composition, adhesive agent, and sealing agent
    • Patent number 10,221,282
    • Issue date Mar 5, 2019
    • Namics Corporation
    • Kazuki Iwaya
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Resin composition
    • Patent number 9,926,405
    • Issue date Mar 27, 2018
    • Namics Corporation
    • Kazuki Iwaya
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

  • Information Patent Application

    CURING AGENT COMPOSITION FOR CURING 2-METHYLENE-1,3-DICARBONYL COMP...
    • Publication number 20210388128
    • Publication date Dec 16, 2021
    • NAMICS CORPORATION
    • Fuminori ARAI
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    RESIN COMPOSITION
    • Publication number 20210380851
    • Publication date Dec 9, 2021
    • NAMICS CORPORATION
    • Ayako SATO
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    RESIN COMPOSITION
    • Publication number 20200283551
    • Publication date Sep 10, 2020
    • NAMICS CORPORATION
    • Fuminori ARAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RESIN COMPOSITION
    • Publication number 20200148922
    • Publication date May 14, 2020
    • NAMICS CORPORATION
    • Fuminori ARAI
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, DAM AGENT, SEMICONDU...
    • Publication number 20200123375
    • Publication date Apr 23, 2020
    • Namics Corporation
    • Kazuki IWAYA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    RESIN COMPOSITION
    • Publication number 20180265756
    • Publication date Sep 20, 2018
    • Fuminori ARAI
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    RESIN COMPOSITION
    • Publication number 20180051128
    • Publication date Feb 22, 2018
    • Namics Corporation
    • Kazuki IWAYA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND IMAGE SENSOR MODULE
    • Publication number 20180051127
    • Publication date Feb 22, 2018
    • Namics Corporation
    • Fuminori ARAI
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    RESIN COMPOSITION, ADHESIVE AGENT, AND SEALING AGENT
    • Publication number 20180044478
    • Publication date Feb 15, 2018
    • Namics Corporation
    • Kazuki IWAYA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    RESIN COMPOSITION
    • Publication number 20170073459
    • Publication date Mar 16, 2017
    • Namics Corporation
    • Kazuki IWAYA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...