Fumio Akama

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Patents Grantslast 30 patents

Information Patent Grant
Multi-layer flexible printed circuit board and manufacturing method...
- Patent number 8,004,851
- Issue date Aug 23, 2011
- Nippon Mektron, Ltd.
- Fumio Akama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered circuit board
- Patent number 6,972,383
- Issue date Dec 6, 2005
- Nippon Mektron, Ltd.
- Fumio Akama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for double-sided wiring board
- Patent number 5,595,858
- Issue date Jan 21, 1997
- Nippon Mektron, Ltd.
- Fumio Akama
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
Multi-layer flexible printed circuit board and manufacturing method...
- Publication number 20050186713
- Publication date Aug 25, 2005
- Fumio Akama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered circuit board
- Publication number 20040062019
- Publication date Apr 1, 2004
- NIPPON MEKTRON LTD.
- Fumio Akama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR