Fumio Furusawa

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Ibaraki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Epoxy resin composition and electronic component device
- Patent number 11,767,449
- Issue date Sep 26, 2023
- Resonac Corporation
- Hirokuni Ogihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition and electronic component device
- Patent number 10,865,332
- Issue date Dec 15, 2020
- SHOWA DENKO MATERIALS CO., LTD.
- Hirokuni Ogihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Epoxy Resin Composition and Electronic Component Device
- Publication number 20200140728
- Publication date May 7, 2020
- Hitachi Chemical Company, Ltd.
- Hirokuni OGIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Epoxy Resin Composition and Electronic Component Device
- Publication number 20140234633
- Publication date Aug 21, 2014
- Hirokuni Ogihara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...