Fumio Furusawa

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Tsukuba-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Epoxy resin molding material for sealing and electronic component d...
- Patent number 10,662,315
- Issue date May 26, 2020
- Hitachi Chemical Company, Ltd.
- Mitsuyoshi Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin molding material for sealing use and semiconductor device
- Patent number 7,397,139
- Issue date Jul 8, 2008
- Hitachi Chemical Co., Ltd.
- Ryoichi Ikezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phenyl, naphthly or fluorene cyclopentyl epoxy resins
- Patent number 6,713,589
- Issue date Mar 30, 2004
- Hitachi Chemical Company, Ltd.
- Haruaki Sue
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Phenyl, naphthyl or fluorene cyclopentyl epoxy resins
- Patent number 6,329,492
- Issue date Dec 11, 2001
- Hitachi Chemical Company, Ltd.
- Haruaki Sue
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Phenolic resin, resin composition, molding material for encapsulati...
- Patent number 6,207,789
- Issue date Mar 27, 2001
- Hitachi Chemical Co., Ltd.
- Haruaki Sue
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT D...
- Publication number 20170121505
- Publication date May 4, 2017
- Hitachi Chemical Company, Ltd.
- Mitsuyoshi Hamada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT D...
- Publication number 20140128505
- Publication date May 8, 2014
- HITACHI CHEMICAL COMPANY, LTD.
- Mitsuyoshi Hamada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Epoxy resin molding material for sealing use and semiconductor device
- Publication number 20060214153
- Publication date Sep 28, 2006
- Ryoichi Ikezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cyclopentylene compound and intermediate thereof, epoxy resin compo...
- Publication number 20020065386
- Publication date May 30, 2002
- Hitachi Chemical Company, Ltd.
- Haruaki Sue
- C07 - ORGANIC CHEMISTRY