Fumio Kataoka

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Photosensitive polyimide precursor and its use for pattern formation
- Patent number 6,319,656
- Issue date Nov 20, 2001
- Hitachi Chemical Company, Ltd.
- Haruhiko Kikkawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Surface-protecting film and resin-sealed semiconductor device havin...
- Patent number 6,200,831
- Issue date Mar 13, 2001
- Hitachi, Ltd.
- Jun Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Surface-protecting film and resin-sealed semiconductor device havin...
- Patent number 6,087,006
- Issue date Jul 11, 2000
- Hitachi, Ltd.
- Jun Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitve polymide precursor and its use for pattern formation
- Patent number 6,025,113
- Issue date Feb 15, 2000
- Hitachi Chemical Company, Ltd.
- Haruhiko Kikkawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wiring structure with metal wiring layers and polyimide layers, and...
- Patent number 5,851,681
- Issue date Dec 22, 1998
- Hitachi, Ltd.
- Haruhiko Matsuyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wiring structures and method of manufacturing the same
- Patent number 5,753,372
- Issue date May 19, 1998
- Hitachi, Ltd.
- Hideo Sotokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyimide precursor, polyimide and metalization structure using sai...
- Patent number 5,536,584
- Issue date Jul 16, 1996
- Hitachi, Ltd.
- Hideo Sotokawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Diacylhydrazine photo-reactive compounds
- Patent number 5,399,758
- Issue date Mar 21, 1995
- Hitachi, Ltd.,
- Toshimasa Miura
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Process for fabricating an interconnected multilayer board
- Patent number 5,388,328
- Issue date Feb 14, 1995
- Hitachi, Ltd.
- Hitoshi Yokono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnected multilayer boards and fabrication processes thereof
- Patent number 5,300,735
- Issue date Apr 5, 1994
- Hitachi, Ltd.
- Hitoshi Yokono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyimide precursor, cured product thereof, and processes for produ...
- Patent number 5,272,247
- Issue date Dec 21, 1993
- Hitachi, Ltd.
- Hideo Sotokawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing organic silicon-terminated polyimide precurso...
- Patent number 4,748,228
- Issue date May 31, 1988
- Hitachi Ltd.
- Fusaji Shoji
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for preparation of 3,3',4,4'-biphenyltetracarboxylic acid s...
- Patent number 4,727,185
- Issue date Feb 23, 1988
- Hitachi, Ltd.
- Fusaji Shoji
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Flexible photosensitive polymer composition with azide and/or amine...
- Patent number 4,587,197
- Issue date May 6, 1986
- Hitachi, Ltd.
- Mithumasa Kojima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Light-sensitive polymer composition with poly(amic acid), bisazide,...
- Patent number 4,565,767
- Issue date Jan 21, 1986
- Hitachi, Ltd.
- Fumio Kataoka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive resin composition and method for forming fine patter...
- Patent number 4,554,237
- Issue date Nov 19, 1985
- Hitach, Ltd.
- Fumio Kataoka
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Heat-resistant silicone block polymer
- Patent number 4,513,132
- Issue date Apr 23, 1985
- Hitachi, Ltd.
- Fusaji Shoji
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Radiation-sensitive poly(amic acid) polymer composition
- Patent number 4,451,551
- Issue date May 29, 1984
- Hitachi, Ltd.
- Fumio Kataoka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Photosensitive polyimide precursor and its use for pattern formation
- Publication number 20020048726
- Publication date Apr 25, 2002
- Hitachi Chemical Company, Ltd.
- Haruhiko Kikkawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Fumio Kataoka

Person

Patents Grantslast 30 patents

Photosensitive polyimide precursor and its use for pattern formation

Surface-protecting film and resin-sealed semiconductor device havin...

Surface-protecting film and resin-sealed semiconductor device havin...

Photosensitve polymide precursor and its use for pattern formation

Wiring structure with metal wiring layers and polyimide layers, and...

Wiring structures and method of manufacturing the same

Polyimide precursor, polyimide and metalization structure using sai...

Diacylhydrazine photo-reactive compounds

Process for fabricating an interconnected multilayer board

Interconnected multilayer boards and fabrication processes thereof

Polyimide precursor, cured product thereof, and processes for produ...

Process for producing organic silicon-terminated polyimide precurso...

Process for preparation of 3,3',4,4'-biphenyltetracarboxylic acid s...

Flexible photosensitive polymer composition with azide and/or amine...

Light-sensitive polymer composition with poly(amic acid), bisazide,...

Photosensitive resin composition and method for forming fine patter...

Heat-resistant silicone block polymer

Radiation-sensitive poly(amic acid) polymer composition

Patents Applicationslast 30 patents

Photosensitive polyimide precursor and its use for pattern formation