TREA

Fumio SAKATA

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  • Koshi City, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding system
    • Patent number 10,840,213
    • Issue date Nov 17, 2020
    • Tokyo Electron Limited
    • Masataka Matsunaga
    • B32 - LAYERED PRODUCTS
  • Information Patent Grant

    Substrate transfer device and bonding system
    • Patent number 10,424,502
    • Issue date Sep 24, 2019
    • Tokyo Electron Limited
    • Masataka Matsunaga
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    BONDING SYSTEM
    • Publication number 20180019226
    • Publication date Jan 18, 2018
    • TOKYO ELECTRON LIMITED
    • Masataka MATSUNAGA
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    SUBSTRATE TRANSFER DEVICE AND BONDING SYSTEM
    • Publication number 20180019153
    • Publication date Jan 18, 2018
    • TOKYO ELECTRON LIMITED
    • Masataka MATSUNAGA
    • H01 - BASIC ELECTRIC ELEMENTS