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Gunma, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Workpiece holder for polishing, workpiece polishing apparatus and p...
Patent number
8,268,114
Issue date
Sep 18, 2012
Shin-Etsu Handotai Co., Ltd.
Hisashi Masumura
B24 - GRINDING POLISHING
Information
Patent Grant
Workpiece holder for polishing, apparatus for polishing workpiece a...
Patent number
6,422,922
Issue date
Jul 23, 2002
Shin-Etsu Handotai Co., Ltd.
Kouichi Okamura
B24 - GRINDING POLISHING
Information
Patent Grant
Method and apparatus for polishing work
Patent number
6,399,498
Issue date
Jun 4, 2002
Shin-Etsu Handotai Co., Ltd.
Hisashi Masumura
B24 - GRINDING POLISHING
Information
Patent Grant
Workpiece holder for polishing, method for producing the same, meth...
Patent number
6,386,957
Issue date
May 14, 2002
Shin-Etsu Handotai Co., Ltd.
Hisashi Masumura
B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information
Patent Grant
Polishing method and polishing device
Patent number
6,332,830
Issue date
Dec 25, 2001
Shin-Etsu Handotai Co., Ltd.
Kouichi Okamura
B24 - GRINDING POLISHING
Information
Patent Grant
Workpiece holding mechanism
Patent number
5,913,719
Issue date
Jun 22, 1999
Shin-Etsu Handotai Co., Ltd.
Fumihiko Hasegawa
B24 - GRINDING POLISHING
Information
Patent Grant
Apparatus for mirror-polishing thin plate
Patent number
5,879,220
Issue date
Mar 9, 1999
Shin-Etsu Handotai Co., Ltd.
Fumihiko Hasegawa
B24 - GRINDING POLISHING
Information
Patent Grant
Apparatus for polishing wafers
Patent number
5,860,853
Issue date
Jan 19, 1999
Shin-Etsu Handotai Co., Ltd.
Fumihiko Hasegawa
B24 - GRINDING POLISHING
Information
Patent Grant
Polishing machine and method of dissipating heat therefrom
Patent number
5,718,620
Issue date
Feb 17, 1998
Shin-Etsu Handotai
Kohichi Tanaka
B24 - GRINDING POLISHING
Information
Patent Grant
Method of polishing semiconductor wafers and apparatus therefor
Patent number
5,584,746
Issue date
Dec 17, 1996
Shin-Etsu Handotai Co., Ltd.
Kouichi Tanaka
B24 - GRINDING POLISHING
Information
Patent Grant
Polishing member and wafer polishing apparatus
Patent number
5,564,965
Issue date
Oct 15, 1996
Shin-Etsu Handotai Co., Ltd.
Kouichi Tanaka
B24 - GRINDING POLISHING
Information
Patent Grant
Polishing machine and method of dissipating heat therefrom
Patent number
5,400,547
Issue date
Mar 28, 1995
Shin-Etsu Handotai Co., Ltd.
Kohichi Tanaka
B24 - GRINDING POLISHING
Information
Patent Grant
Method of chucking semiconductor wafers
Patent number
5,335,457
Issue date
Aug 9, 1994
Shin-Etsu Handotai Co., Ltd.
Akira Matsuda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and an apparatus for handling wafers
Patent number
5,226,758
Issue date
Jul 13, 1993
Shin-Etsu Handotai Co., Ltd.
Kohichi Tanaka
B24 - GRINDING POLISHING
Patents Applications
last 30 patents
Information
Patent Application
Grinding work holding disk, work grinding device and grinding method
Publication number
20040238121
Publication date
Dec 2, 2004
Hisashi Masumura
B24 - GRINDING POLISHING