Fumitaka MOROISHI

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for manufacturing semiconductor device and method of manu...
- Patent number 12,051,604
- Issue date Jul 30, 2024
- Samsung Electronics Co., Ltd.
- Daisuke Nagatomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding method, method for manufacturing semiconductor device...
- Patent number 10,847,369
- Issue date Nov 24, 2020
- Samsung Electronics Co., Ltd.
- Shinji Ueyama
- G01 - MEASURING TESTING
Information Patent Grant
Water measurement apparatus
- Patent number 10,823,682
- Issue date Nov 3, 2020
- Samsung Electronics Co., Ltd.
- Takamasa Sugiura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fluid pressure actuator
- Patent number 9,726,204
- Issue date Aug 8, 2017
- Samsung Electronics Co., Ltd.
- Masato Kajinami
- F15 - FLUID-PRESSURE ACTUATORS HYDRAULICS OR PNEUMATICS IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES AND METHOD OF MAN...
- Publication number 20240186174
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Fumitaka MOROISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE AND OPTICAL MEASUREMENT METHOD
- Publication number 20240183657
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Daisuke NAGATOMO
- G01 - MEASURING TESTING
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20240186278
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Masato KAJINAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PEELING APARATUS AND CHIP PEELING METHOD
- Publication number 20230369078
- Publication date Nov 16, 2023
- Samsung Electronics Co., Ltd.
- Tatsuya ISHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20230187249
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- Daisuke NAGATOMO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANU...
- Publication number 20220216077
- Publication date Jul 7, 2022
- Samsung Electronics Co., Ltd.
- Daisuke Nagatomo
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
WAFER BONDING APPARATUS
- Publication number 20220157633
- Publication date May 19, 2022
- Samsung Electronics Co., Ltd.
- Masato KAJINAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WATER MEASUREMENT APPARATUS
- Publication number 20200217805
- Publication date Jul 9, 2020
- Samsung Electronics Co., Ltd.
- Takamasa SUGIURA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER BONDING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20200209164
- Publication date Jul 2, 2020
- Samsung Electronics Co., Ltd.
- Shinji UEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID PRESSURE ACTUATOR
- Publication number 20150159681
- Publication date Jun 11, 2015
- Samsung Electronics Co., Ltd.
- Masato KAJINAMI
- F15 - FLUID-PRESSURE ACTUATORS HYDRAULICS OR PNEUMATICS IN GENERAL

Fumitaka MOROISHI

Person

Patents Grantslast 30 patents

Apparatus for manufacturing semiconductor device and method of manu...

Wafer bonding method, method for manufacturing semiconductor device...

Water measurement apparatus

Fluid pressure actuator

Patents Applicationslast 30 patents

APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES AND METHOD OF MAN...

OPTICAL DEVICE AND OPTICAL MEASUREMENT METHOD

MOUNTING DEVICE AND MOUNTING METHOD

CHIP PEELING APARATUS AND CHIP PEELING METHOD

MOUNTING DEVICE AND MOUNTING METHOD

APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANU...

WAFER BONDING APPARATUS

WATER MEASUREMENT APPARATUS

WAFER BONDING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

FLUID PRESSURE ACTUATOR