Fumito Ito

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Ibaraki-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board, IC card module using the same, and method for...
- Patent number 6,433,285
- Issue date Aug 13, 2002
- Matsushita Electronics Corporation
- Kenji Maeda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Resin-molded semiconductor device, method for manufacturing the sam...
- Patent number 6,338,984
- Issue date Jan 15, 2002
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe for use in manufacturing a resin-molded semiconductor device
- Patent number 6,208,020
- Issue date Mar 27, 2001
- Matsushita Electronics Corporation
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Printed wiring board, IC card module using the same, and method for...
- Publication number 20010025721
- Publication date Oct 4, 2001
- Kenji Maeda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Resin-molded semicondutor device, method for manufacturing the same...
- Publication number 20010007780
- Publication date Jul 12, 2001
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS