Fumitomo Watanabe

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assemblies with molded support substrates
- Patent number 12,119,325
- Issue date Oct 15, 2024
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies with molded support substrates
- Patent number 10,998,290
- Issue date May 4, 2021
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies with molded support substrates
- Patent number 10,217,719
- Issue date Feb 26, 2019
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,810,047
- Issue date Aug 19, 2014
- PS4 Luxco S.A.R.L.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,786,102
- Issue date Jul 22, 2014
- PS4 Luxco S.A.R.L.
- Masanori Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a first conductive member connecting a...
- Patent number 8,710,647
- Issue date Apr 29, 2014
- Yutaka Kagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,575,763
- Issue date Nov 5, 2013
- Elpida Memory, Inc.
- Masanori Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a first land on the wiring substrate...
- Patent number 8,076,770
- Issue date Dec 13, 2011
- Elpida Memory, Inc.
- Yutaka Kagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including mounting and...
- Patent number 7,993,975
- Issue date Aug 9, 2011
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,928,551
- Issue date Apr 19, 2011
- Elpida Memory, Inc.
- Reiko Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a semiconductor chip which is mounte...
- Patent number 7,888,179
- Issue date Feb 15, 2011
- Elpida Memory, Inc.
- Yutaka Kagaya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES
- Publication number 20210225805
- Publication date Jul 22, 2021
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES
- Publication number 20190148338
- Publication date May 16, 2019
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES
- Publication number 20180294249
- Publication date Oct 11, 2018
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140035161
- Publication date Feb 6, 2014
- ELPIDA MEMORY, INC.
- Masanori YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120032353
- Publication date Feb 9, 2012
- Elpida Memory, Inc.
- Yutaka KAGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110057327
- Publication date Mar 10, 2011
- ELPIDA MEMORY, INC.
- Masanori YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20100102438
- Publication date Apr 29, 2010
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20090321920
- Publication date Dec 31, 2009
- Elpida Memory, Inc.
- Shinichi Sakurada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090189297
- Publication date Jul 30, 2009
- ELPIDA MEMORY, INC.
- Katsumi Sugawara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20090166863
- Publication date Jul 2, 2009
- ELPIDA MEMORY, INC.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
- Publication number 20090129036
- Publication date May 21, 2009
- Elpida Memory, Inc.
- SEIYA FUJII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20090096111
- Publication date Apr 16, 2009
- Elpida Memory, Inc.
- Reiko Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090045497
- Publication date Feb 19, 2009
- Elpida Memory, Inc.
- Yutaka KAGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SEMICONDUCTOR CHIP WHICH IS MOUNTE...
- Publication number 20090039506
- Publication date Feb 12, 2009
- Elpida Memory, Inc.
- Yutaka Kagaya
- H01 - BASIC ELECTRIC ELEMENTS

Fumitomo Watanabe

Person

Patents Grantslast 30 patents

Semiconductor device assemblies with molded support substrates

Semiconductor device assemblies with molded support substrates

Semiconductor device assemblies with molded support substrates

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device having a first conductive member connecting a...

Semiconductor device and method of manufacturing the same

Semiconductor device including a first land on the wiring substrate...

Method of manufacturing semiconductor device including mounting and...

Semiconductor device and method of manufacturing the same

Semiconductor device including a semiconductor chip which is mounte...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES

SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES

SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR DEVICE

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE INCLUDING A SEMICONDUCTOR CHIP WHICH IS MOUNTE...