Fumitoshi Ikegaya

Person

Ebina-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 10,738,389
- Issue date Aug 11, 2020
- TOSHIBA MEMORY CORPORATION
- Takashi Izumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor manufacturing apparatus and manufacturing method of s...
- Patent number 10,483,126
- Issue date Nov 19, 2019
- TOSHIBA MEMORY CORPORATION
- Takashi Izumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing a wiring board
- Patent number 7,526,859
- Issue date May 5, 2009
- Dai Nippon Printing Co., Ltd.
- Kenji Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a wiring board
- Patent number 7,134,193
- Issue date Nov 14, 2006
- Dai Nippon Printing Co., Ltd.
- Kenji Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for manufacturing a wiring board
- Patent number 6,865,801
- Issue date Mar 15, 2005
- Kabushiki Kaisha Toshiba
- Kenji Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for manufacturing a wiring substrate
- Patent number 6,507,995
- Issue date Jan 21, 2003
- Kabushiki Kaisha Toshiba
- Kenji Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board and method for forming the same
- Patent number 6,010,769
- Issue date Jan 4, 2000
- Kabushiki Kaisha Toshiba
- Kenji Sasaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit devices and fabrication Method of the same
- Patent number 5,822,850
- Issue date Oct 20, 1998
- Kabushiki Kaisha Toshiba
- Hiroshi Odaira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit devices and fabrication method of the same
- Patent number 5,600,103
- Issue date Feb 4, 1997
- Kabushiki Kaisha Toshiba
- Hiroshi Odaira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF S...
- Publication number 20180226268
- Publication date Aug 9, 2018
- Toshiba Memory Corporation
- Takashi Izumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20160362793
- Publication date Dec 15, 2016
- KABUSHIKI KAISHA TOSHIBA
- Takashi IZUMI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER PLATING APPARATUS, COPPER PLATING METHOD AND METHOD FOR MANU...
- Publication number 20150068911
- Publication date Mar 12, 2015
- KABUSHIKI KAISHA TOSHIBA
- Fumitoshi IKEGAYA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus for manufacturing a wiring board and method for manufactu...
- Publication number 20070044294
- Publication date Mar 1, 2007
- DAI NIPPON PRINTING CO., LTD.
- Kenji Sasaoka
- B32 - LAYERED PRODUCTS
Information Patent Application
Method of manufacturing a semiconductor device and semiconductor de...
- Publication number 20050272258
- Publication date Dec 8, 2005
- Toshiyuki Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for manufacturing a wiring board and method for manufactu...
- Publication number 20050115068
- Publication date Jun 2, 2005
- Kabushiki Kaisha Toshiba
- Kenji Sasaoka
- B32 - LAYERED PRODUCTS
Information Patent Application
Apparatus for manufacturing a wiring board and method for manufactu...
- Publication number 20010039720
- Publication date Nov 15, 2001
- Kabushiki Kaisha Toshiba
- Kenji Sasaoka
- B32 - LAYERED PRODUCTS

Fumitoshi Ikegaya

Person

Patents Grantslast 30 patents

Semiconductor manufacturing apparatus

Semiconductor manufacturing apparatus and manufacturing method of s...

Apparatus for manufacturing a wiring board

Method for manufacturing a wiring board

Apparatus for manufacturing a wiring board

Apparatus for manufacturing a wiring substrate

Multilayer wiring board and method for forming the same

Circuit devices and fabrication Method of the same

Circuit devices and fabrication method of the same

Patents Applicationslast 30 patents

SEMICONDUCTOR MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF S...

SEMICONDUCTOR MANUFACTURING APPARATUS

COPPER PLATING APPARATUS, COPPER PLATING METHOD AND METHOD FOR MANU...

Apparatus for manufacturing a wiring board and method for manufactu...

Method of manufacturing a semiconductor device and semiconductor de...

Apparatus for manufacturing a wiring board and method for manufactu...

Apparatus for manufacturing a wiring board and method for manufactu...