Fuqiang Xiao

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Wire bond pad design for compact stacked-die package
- Patent number 12,051,660
- Issue date Jul 30, 2024
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond pad design for compact stacked-die package
- Patent number 11,189,582
- Issue date Nov 30, 2021
- WESTERN DIGITAL TECHNOLOGIES. INC.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out semiconductor device including a plurality of semiconductor...
- Patent number 10,177,119
- Issue date Jan 8, 2019
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Cong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waterfall wire bonding
- Patent number 9,704,797
- Issue date Jul 11, 2017
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Zhong Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE BOND PAD DESIGN FOR COMPACT STACKED-DIE PACKAGE
- Publication number 20220052002
- Publication date Feb 17, 2022
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND PAD DESIGN FOR COMPACT STACKED-DIE PACKAGE
- Publication number 20210151399
- Publication date May 20, 2021
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF SEMICONDUCTOR...
- Publication number 20180019228
- Publication date Jan 18, 2018
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Cong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WATERFALL WIRE BONDING
- Publication number 20140183727
- Publication date Jul 3, 2014
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Zhong Lu
- H01 - BASIC ELECTRIC ELEMENTS