Gabriel Maier

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Regensburg, DE

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Patents Grantslast 30 patents

Information Patent Grant
Methods for manufacturing a chip arrangement, methods for manufactu...
- Patent number 9,576,875
- Issue date Feb 21, 2017
- Infineon Technologies AG
- Reinhard Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing a chip arrangement, methods for manufactu...
- Patent number 8,951,915
- Issue date Feb 10, 2015
- Infineon Technologies AG
- Reinhard Hess
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HANDLING THIN WAFER DURING CHIP MANUFACTURE
- Publication number 20180233470
- Publication date Aug 16, 2018
- INFINEON TECHNOLOGIES AG
- Thomas Killer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MANUFACTURING A CHIP ARRANGEMENT, METHODS FOR MANUFACTU...
- Publication number 20150115417
- Publication date Apr 30, 2015
- INFINEON TECHNOLOGIES AG
- Reinhard Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for manufacturing a chip arrangement, methods for manufactu...
- Publication number 20140070376
- Publication date Mar 13, 2014
- INFINEON TECHNOLOGIES AG
- Reinhard Hess
- H01 - BASIC ELECTRIC ELEMENTS