Gabriel Wong

Person

Richmond, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip package with undermount passive devices
- Patent number 9,607,935
- Issue date Mar 28, 2017
- ATI Technologies ULC
- Liane Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Routing layer for mitigating stress in a semiconductor die
- Patent number 9,059,159
- Issue date Jun 16, 2015
- ATI Technologies ULC
- Roden Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Routing layer for mitigating stress in a semiconductor die
- Patent number 9,035,471
- Issue date May 19, 2015
- ATI Technologies ULC
- Roden Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Routing layer for mitigating stress in a semiconductor die
- Patent number 8,664,777
- Issue date Mar 4, 2014
- ATI Technologies ULC
- Roden Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Routing layer for mitigating stress in a semiconductor die
- Patent number 8,642,463
- Issue date Feb 4, 2014
- ATI Technologies ULC
- Roden Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Routing layer for mitigating stress in a semiconductor die
- Patent number 8,299,632
- Issue date Oct 30, 2012
- ATI Technologies ULC
- Roden Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Routing layer for mitigating stress in a semiconductor die
- Patent number 8,227,926
- Issue date Jul 24, 2012
- ATI Technologies ULC
- Roden Topacio
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ROUTING LAYER FOR MITIGATING STRESS IN A SEMICONDUCTOR DIE
- Publication number 20140167261
- Publication date Jun 19, 2014
- ATI Technologies ULC
- Roden Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTING LAYER FOR MITIGATING STRESS IN A SEMICONDUCTOR DIE
- Publication number 20140110837
- Publication date Apr 24, 2014
- ATI Technologies ULC
- Roden Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTING LAYER FOR MITIGATING STRESS IN A SEMICONDUCTOR DIE
- Publication number 20130032941
- Publication date Feb 7, 2013
- ATI Technologies ULC
- Roden Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTING LAYER FOR MITIGATING STRESS IN A SEMICONDUCTOR DIE
- Publication number 20120270388
- Publication date Oct 25, 2012
- ATI Technologies ULC
- Roden Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTING LAYER FOR MITIGATING STRESS IN A SEMICONDUCTOR DIE
- Publication number 20110254154
- Publication date Oct 20, 2011
- ATI Technologies ULC
- Roden Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTING LAYER FOR MITIGATING STRESS IN A SEMICONDUCTOR DIE
- Publication number 20110095415
- Publication date Apr 28, 2011
- ATI Technologies ULC
- Roden Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package with Undermount Passive Devices
- Publication number 20100265682
- Publication date Oct 21, 2010
- Liane Martinez
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Gabriel Wong

Person

Patents Grantslast 30 patents

Semiconductor chip package with undermount passive devices

Routing layer for mitigating stress in a semiconductor die

Routing layer for mitigating stress in a semiconductor die

Routing layer for mitigating stress in a semiconductor die

Routing layer for mitigating stress in a semiconductor die

Routing layer for mitigating stress in a semiconductor die

Routing layer for mitigating stress in a semiconductor die

Patents Applicationslast 30 patents

ROUTING LAYER FOR MITIGATING STRESS IN A SEMICONDUCTOR DIE

ROUTING LAYER FOR MITIGATING STRESS IN A SEMICONDUCTOR DIE

ROUTING LAYER FOR MITIGATING STRESS IN A SEMICONDUCTOR DIE

ROUTING LAYER FOR MITIGATING STRESS IN A SEMICONDUCTOR DIE

ROUTING LAYER FOR MITIGATING STRESS IN A SEMICONDUCTOR DIE

ROUTING LAYER FOR MITIGATING STRESS IN A SEMICONDUCTOR DIE

Semiconductor Chip Package with Undermount Passive Devices