Gai Leong Lai

Follow

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with leads and method of manufa...
- Patent number 8,802,500
- Issue date Aug 12, 2014
- Stats Chippac Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Stress Relief Vias in Mu...
- Publication number 20240355760
- Publication date Oct 24, 2024
- STATS ChipPAC Pte Ltd.
- Peik Eng Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADS AND METHOD OF MANUFA...
- Publication number 20110108969
- Publication date May 12, 2011
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS