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Gaku HASHIMOTO
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Chiyoda-ku, Tokyo, JP
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last 30 patents
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Patent Grant
Polyamideimide resin, resin composition, and semiconductor device
Patent number
12,319,814
Issue date
Jun 3, 2025
Resonac Corporation
Gaku Hashimoto
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Patents Applications
last 30 patents
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Patent Application
POLYAMIDEIMIDE RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE
Publication number
20220332947
Publication date
Oct 20, 2022
Showa Denko Materials Co., Ltd.
Gaku HASHIMOTO
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...