Gaku Ishii

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Yokohama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Power amplifying module
- Patent number 5,835,352
- Issue date Nov 10, 1998
- Sumitomo Electric Industries, Ltd.
- Ken-ichiro Matsuzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component contained in a metal package
- Patent number 5,757,251
- Issue date May 26, 1998
- Sumitomo Electric Industries, Ltd.
- Tatsuya Hashinaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power amplifying module
- Patent number 5,754,402
- Issue date May 19, 1998
- Sumitomo Electric Industries, Ltd.
- Ken-ichiro Matsuzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an ohmic electrode using a TiW layer and an Au layer
- Patent number 5,422,307
- Issue date Jun 6, 1995
- Sumitomo Electric Industries, Ltd.
- Gaku Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound semiconductor integrated circuit device
- Patent number 5,274,283
- Issue date Dec 28, 1993
- Sumitomo Electric Industries, Ltd.
- Yoshimichi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS